Patents by Inventor Rick Beyerle

Rick Beyerle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
    Patent number: 7355428
    Abstract: A temperature control system, which includes a miniature liquid-cooled heat sink, is used to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing or burn-in phase. In one embodiment, the system includes a miniature liquid-cooled heat sink device having a monolithic counter-flowing structure. In other embodiments, the system includes a heater, a flow control valve, a controller, and/or sensors.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: April 8, 2008
    Assignee: Delta Design, Inc.
    Inventors: Samer Kabbani, Rick Beyerle, Don Bachelder
  • Thermal control of a DUT using a thermal control substrate
    Patent number: 6985000
    Abstract: A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: January 10, 2006
    Assignee: Delta Design, Inc.
    Inventors: Jan Feder, Rick Beyerle, Stephen Byers, Thomas Jones
  • Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing
    Publication number: 20050151553
    Abstract: A temperature control system, which includes a miniature liquid-cooled heat sink, is used to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing or bum-in phase. In one embodiment, the system includes a miniature liquid-cooled heat sink device having a monolithic counter-flowing structure. In other embodiments, the system includes a heater, a flow control valve, a controller, and/or sensors.
    Type: Application
    Filed: January 14, 2004
    Publication date: July 14, 2005
    Inventors: Samer Kabbani, Rick Beyerle, Don Bachelder
  • Thermal control of a DUT using a thermal control substrate
    Publication number: 20050007136
    Abstract: A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
    Type: Application
    Filed: July 28, 2004
    Publication date: January 13, 2005
    Inventors: Jan Feder, Rick Beyerle, Stephen Byers, Thomas Jones
  • Thermal control of a DUT using a thermal control substrate
    Patent number: 6825681
    Abstract: A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: November 30, 2004
    Assignee: Delta Design, Inc.
    Inventors: Jan Feder, Rick Beyerle, Stephen Byers, Thomas Jones
  • Thermal control of a DUT using a thermal contro substrate
    Publication number: 20040012404
    Abstract: A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
    Type: Application
    Filed: July 19, 2002
    Publication date: January 22, 2004
    Applicant: Delta Design, Inc.
    Inventors: Jan Feder, Rick Beyerle, Stephen Byers, Thomas Jones