Patents by Inventor Rick Canham

Rick Canham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BACKSIDE INTEGRATED TORSION LOADING MECHANISM
    Publication number: 20230395460
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.
    Type: Application
    Filed: August 16, 2023
    Publication date: December 7, 2023
    Inventors: David Shia, Rick Canham, Eric W. Buddrius, Jeffory L. Smalley, John Beatty, Kenan Arik, Mohanraj Prabhugoud, Kirk Wheeler, Shelby Ferguson, Jorge Contreras Perez, Daniel Neumann, Ernesto Borboa Lizarraga
  • Method of placing a chip assembly in a socket housing
    Patent number: 8904630
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: December 9, 2014
    Assignee: Intel Corporation
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins
  • SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
    Publication number: 20120151762
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Application
    Filed: February 28, 2012
    Publication date: June 21, 2012
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins
  • Sliding package retention device for LGA sockets
    Patent number: 8151450
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: April 10, 2012
    Assignee: Intel Corporation
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins
  • SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
    Publication number: 20100162561
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Application
    Filed: December 31, 2008
    Publication date: July 1, 2010
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins