Patents by Inventor Rick Canham

Rick Canham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SUBSTRATES AND INTERFACES
    Publication number: 20240357744
    Abstract: Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 24, 2024
    Applicant: Intel Corporation
    Inventors: Rick Canham, Jeffory L. Smalley, Steven Adam Klein, Shelby Ann Ferguson
  • SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES
    Publication number: 20240222288
    Abstract: Integrated circuit (IC) device substrates and structures for mating and aligning with sockets. An IC device may include a frame on and around a substrate, which may include glass or silicon. The frame may include an alignment feature, such as a notch or hole, to mate with a complementary keying feature of a socket. A heat spreader may be coupled to an IC die and extend beyond the substrate or be coupled to the frame. The heat spreader may include a heat pipe. The IC device may be part of an IC system with the device substrate coupled to a system substrate by a socket configured to mate to the frame.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Applicant: Intel Corporation
    Inventors: David Shia, Timothy Gosselin, Aravindha Antoniswamy, Sergio Antonio Chan Arguedas, Elah Bozorg-Grayeli, Johnny Cook, JR., Steven Klein, Rick Canham
  • BACKSIDE INTEGRATED TORSION LOADING MECHANISM
    Publication number: 20230395460
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.
    Type: Application
    Filed: August 16, 2023
    Publication date: December 7, 2023
    Inventors: David Shia, Rick Canham, Eric W. Buddrius, Jeffory L. Smalley, John Beatty, Kenan Arik, Mohanraj Prabhugoud, Kirk Wheeler, Shelby Ferguson, Jorge Contreras Perez, Daniel Neumann, Ernesto Borboa Lizarraga
  • Method of placing a chip assembly in a socket housing
    Patent number: 8904630
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: December 9, 2014
    Assignee: Intel Corporation
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins
  • SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
    Publication number: 20120151762
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Application
    Filed: February 28, 2012
    Publication date: June 21, 2012
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins
  • Sliding package retention device for LGA sockets
    Patent number: 8151450
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: April 10, 2012
    Assignee: Intel Corporation
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins
  • SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS
    Publication number: 20100162561
    Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.
    Type: Application
    Filed: December 31, 2008
    Publication date: July 1, 2010
    Inventors: Rick Canham, Tozer Bandorawalla, Alan McAllister, Kelly Eakins