Patents by Inventor Rick Davis

Rick Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • One-mask process flow for simultaneously constructing a capacitor and a thin film resistor
    Publication number: 20040063295
    Abstract: A method includes forming a first damascene interconnect layer in a first dielectric. A first dielectric film is deposited on the first dielectric and on the first damascene interconnect layer. A conductor layer is deposited on the first dielectric film. The conductor layer is patterned, via a single mask, to form a first conductor and a second conductor. The first damascene interconnect level, the first dielectric film, and the first conductor form a capacitor and the second conductor forms a resistor.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 1, 2004
    Applicant: Intel Corporation
    Inventors: Stephen T. Chambers, Rick Davis, Philip Yashar
  • Method for making integrated circuit having polymer interlayer dielectric
    Patent number: 6037255
    Abstract: An improved method for making an integrated circuit that includes forming a conductive layer on a substrate, then forming a dielectric layer comprising a polymer on the conductive layer. After forming the dielectric layer, a layer of photoresist is patterned to define a region to be etched. An etched region is then formed through the dielectric layer while simultaneously removing the layer of photoresist.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: March 14, 2000
    Assignee: Intel Corporation
    Inventors: Makarem A. Hussein, Sam Sivakumar, Rick Davis