Abstract: Some embodiments include an x-ray detector, comprising: a substrate including: a plurality of pixels; configured to convert incident x-ray into electrical signals; a plurality of data lines coupled to the pixels; a printed circuit assembly (PCA) including: a circuit configured to convert the electrical signals into digitized data; and an interconnect electrically connected between the data lines and the circuit and configured to transfer the electrical signals from the substrate to the PCA.

Abstract: Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.

Abstract: Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.