Patents by Inventor Rick HEIB

Rick HEIB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular flooring assemblies
    Patent number: 10781595
    Abstract: Disclosed herein is a modular flooring assembly including a flooring component adhered to a first tray substrate and a second tray substrate which are interconnected to form an assembled tray substrate. The assembled tray substrate may be interconnected with additional assembled tray substrates to form a modular floor suitable for most flooring applications. The flooring component may be tile or wood or other materials commonly used in flooring applications. Convention fill-in grout or a snap-in grout may be used with the modular flooring assemblies.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: September 22, 2020
    Assignee: CoMc, LLC
    Inventors: Jonathan McIntosh, Rick Heib, Chris Wurtele, Steve Neubaum
  • MODULAR FLOORING ASSEMBLIES
    Publication number: 20200232227
    Abstract: Disclosed herein is a modular flooring assembly including a flooring component adhered to a first tray substrate and a second tray substrate which are interconnected to form an assembled tray substrate. The assembled tray substrate may be interconnected with additional assembled tray substrates to form a modular floor suitable for most flooring applications. The flooring component may be tile or wood or other materials commonly used in flooring applications. Convention fill-in grout or a snap-in grout may be used with the modular flooring assemblies.
    Type: Application
    Filed: September 9, 2016
    Publication date: July 23, 2020
    Applicant: CoMc, LLC
    Inventors: Jonathan MCINTOSH, Rick HEIB, Chris WURTELE, Steve NEUBAUM