Patents by Inventor Rick L. Edmiston

Rick L. Edmiston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6489706
    Abstract: A plurality of piezomaterial bodies, such as panels or slices, are merged together to form a larger piezomaterial body. For example, a 0.75×22 cm polycrystalline piezomaterial body is formed, where the distances are along lateral or footprint dimensions. The thickness of the piezomaterial body is substantially less than either of the distances along first and second lateral dimensions that define the footprint. Preferably, each piezomaterial body has a panel shape, and a plurality of panels are merged to form a large multi-panel.
    Type: Grant
    Filed: November 13, 1998
    Date of Patent: December 3, 2002
    Assignee: Acuson Corporation
    Inventors: John W. Sliwa, Jr., Rick L. Edmiston, Matthew T. Spigelmyer, Vaughn R. Marian, Jr., John P. Mohr, III, John A. Hossack
  • Publication number: 20010015592
    Abstract: A plurality of piezomaterial bodies, such as panels or slices, are merged together to form a larger piezomaterial body. For example, a 0.75×22 cm polycrystalline piezomaterial body is formed, where the distances are along lateral or footprint dimensions. The thickness of the piezomaterial body is substantially less than either of the distances along first and second lateral dimensions that define the footprint. Preferably, each piezomaterial body has a panel shape, and a plurality of panels are merged to form a large multi-panel.
    Type: Application
    Filed: November 13, 1998
    Publication date: August 23, 2001
    Inventors: JOHN W. SLIWA JR., RICK L. EDMISTON, MATTHEW T. SPIGELMYER, VAUGHN R. MARIAN JR., JOHN P. MOHR III, JOHN A. HOSSACK