Abstract: A lumped element circulator is provided in addition to a method for producing and flip mounting the circulator to a substrate. The resonant elements of the circulator are connected in either a delta or Y configuration which produces a three port electrical circuit. The fabrication technique associated with this invention allows the lumped element circulator to be manufactured in either a crossover or non-crossover style circulator. The circulator includes a ferrite layer having three inductors formed on its top surface to create either the delta or Y resonant element configuration. Contact bumps are attached at the terminal locations of the inductors. A magnet is secured to the bottom of the ferrite layer, forming a ferrite wafer. Optionally, a dielectric layer is disposed between the ferrite and the magnet. A plurality of capacitors and mounting pads are formed on a separate substrate by printing metal strips thereon.

Abstract: A transition for providing connection between a stripline transmission line which is buried in a substrate and the surface of the substrate where components are mounted. A three-wire line disposed orthogonally to the stripline is directly connected to the stripline. The center wire of the three-wire line is connected to the stripline center conductor strip, and the two ground wires are connected to the upper and lower ground planes of the stripline. The center wire of the three-wire line passes through an open area formed in the upper stripline ground plane. To improve the performance of the transition, mode conversion between the electric field configuration of stripline and the electric field configuration of three-wire line is provided, by terminating one ground wire at the upper stripline ground plane. The transition can be used to connect to a conductor-backed coplanar waveguide transmission line circuit formed on the substrate surface.

Abstract: A microwave frequency three-wire transmission line provides the capability of solderless interconnections between stacked microwave hybrid and printed wiring board (PWB) assemblies. Three wire-like compressible conductors are embedded in a dielectric support member. Each compressible conductor is realized by densely packing thin wire into an opening in the supporting dielectric. The dielectric preferably has a metal shielding surrounding the outer periphery to suppress higher order modes. A vertical right angle bend transition uses the transmission line to interconnect between grounded coplanar waveguide (GCPW) transmission lines. This orthogonal transition uses button spring contacts, thus creating a reusable solderless vertical interconnection between the two transmission lines.

Abstract: A microwave frequency transmission line provides the capability of solderless interconnections between stacked microwave hybrid and printed wiring board (PWB) assemblies. A wire-like transmission line is embedded in a dielectric and placed in an open square trough. A compressible center conductor is realized by densely packing thin wire into an opening in the supporting dielectric to form the compressible center conductor. A vertical right angle bend transition uses the transmission line to interconnect between grounded coplanar waveguide (CPWG) transmission lines. This orthogonal transition uses button spring contacts, thus creating a reusable solderless vertical interconnection between the two transmission lines. This transition can operate from DC to greater than 15 GHz with good match and low loss, and allows a transition from a CPWG transmission line on a first substrate to another CPWG transmission line on a second substrate stacked above the first substrate.