Patents by Inventor Rick Lee Barnett

Rick Lee Barnett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9398701
    Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: July 19, 2016
    Assignee: General Electric Company
    Inventors: Mark Alan Haisler, Rick Lee Barnett, William L. Woods, Jr., James Edward Harvey
  • Publication number: 20140268608
    Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.
    Type: Application
    Filed: October 23, 2013
    Publication date: September 18, 2014
    Applicant: General Electric Company
    Inventors: Mark Alan Haisler, Rick Lee Barnett, William L. Woods, JR., James Edward Harvey