Patents by Inventor Rick M. Heathwaite

Rick M. Heathwaite has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6612317
    Abstract: A continuous flow, steady state fluid delivery and recovery system for a process chamber and processes requiring supercritical fluid and desired additives including co-solvents, for conducting repetitive batch processing operations in an automated environment, for such processes as supercritical carbon dioxide cleaning and processing of semiconductor wafers. The system provides for steady-state operation of fluid flow and byproducts recovery while the process chamber is brought rapidly and repeatedly on and off line as in batch operations and for various process steps.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: September 2, 2003
    Assignee: S.C. Fluids, INC
    Inventors: Michael A. Costantini, Mohan Chandra, Heiko D. Moritz, Ijaz H. Jafri, David J. Mount, Rick M. Heathwaite
  • Patent number: 6602349
    Abstract: A dry process for the cleaning of precision surfaces such as of semiconductor wafers, by using process materials such as carbon dioxide and useful additives such as cosolvents and surfactants, where the process materials are applied exclusively in gaseous and supercritical states. Soak and agitation steps are applied to the wafer, including a rapid decompression of the process chamber after a soak period at higher supercritical pressure, to mechanically weaken break up the polymers and other materials sought to be removed, combined with a supercritical fluid flush to carry away the loose debris.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: August 5, 2003
    Assignee: S.C. Fluids, Inc.
    Inventors: Mohan Chandra, David J. Mount, Michael A. Costantini, Heiko D. Moritz, Ijaz Jafri, Jim Boyd, Rick M. Heathwaite
  • Publication number: 20020014257
    Abstract: A dry process for the cleaning of precision surfaces such as of semiconductor wafers, by using process materials such as carbon dioxide and useful additives such as cosolvents and surfactants, where the process materials are applied exclusively in gaseous and supercritical states. Soak and agitation steps are applied to the wafer, including a rapid decompression of the process chamber after a soak period at higher supercritical pressure, to mechanically weaken break up the polymers and other materials sought to be removed, combined with a supercritical fluid flush to carry away the loose debris.
    Type: Application
    Filed: May 18, 2001
    Publication date: February 7, 2002
    Inventors: Mohan Chandra, David J. Mount, Michael A. Costantini, Heiko D. Moritz, Ijaz H. Jafri, Jim Boyd, Rick M. Heathwaite
  • Publication number: 20010050096
    Abstract: A continuous flow, steady state fluid delivery and recovery system for a process chamber and processes requiring supercritical fluid and desired additives including co-solvents, for conducting repetitive batch processing operations in an automated environment, for such processes as supercritical carbon dioxide cleaning and processing of semiconductor wafers. The system provides for steady-state operation of fluid flow and byproducts recovery while the process chamber is brought rapidly and repeatedly on and off line as in batch operations and for various process steps.
    Type: Application
    Filed: April 18, 2001
    Publication date: December 13, 2001
    Inventors: Michael A. Costantini, Mohan Chandra, Heiko D. Moritz, Ijaz H. Jafri, David J. Mount, Rick M. Heathwaite