Abstract: A method may include causing a client computer to display a graphical user interface including a content panel configured to display a selected document in a publication-controlled editing mode and in a synchronous editing mode and a navigational panel including a hierarchical element tree. The method may further include, in response to a selection, from a first user, of a selectable element in the hierarchical element tree, causing the document to be displayed in the content panel in the synchronous editing mode. The method may further include, in response to receiving from the first user a request to edit the document in the publication-controlled editing mode, causing the document to be displayed in the content panel in the publication-controlled editing mode.

Abstract: A chemical mechanical polish pad conditioning device is disclosed. The device includes a conditioning substrate made of stainless steel forming a predetermined pattern on a surface. Also, a method of producing a chemical mechanical polish pad conditioning device is disclosed. The method includes providing a conditioning substrate made of stainless steel forming a predetermined pattern on a surface, and applying a hardening process to the surface of the conditioning substrate. The invention further discloses a method of conditioning a chemical mechanical polish pad. The method includes providing a conditioning substrate forming a predetermined pattern on a surface, fixing the conditioning substrate to a conditioning arm, and contacting the surface of the conditioning substrate with a polish pad and moving the conditioning substrate on the polish pad with a predetermined downforce at a predetermined rate of speed.

Abstract: A chemical mechanical polish pad conditioning device is disclosed. The device includes a conditioning substrate made of stainless steel forming a predetermined pattern on a surface. Also, a method of producing a chemical mechanical polish pad conditioning device is disclosed. The method includes providing a conditioning substrate made of stainless steel forming a predetermined pattern on a surface, and applying a hardening process to the surface of the conditioning substrate. The invention further discloses a method of conditioning a chemical mechanical polish pad. The method includes providing a conditioning substrate forming a predetermined pattern on a surface, fixing the conditioning substrate to a conditioning arm, and contacting the surface of the conditioning substrate with a polish pad and moving the conditioning substrate on the polish pad with a predetermined downforce at a predetermined rate of speed.

Abstract: A wafer polishing machine uses a pedestal unit that holds a semiconductor wafer using a vacuum force for polishing the surface of the wafer on a polishing pad and slurry mixture. A gimbal mechanism is implemented within the pedestal unit so that the various portions of the wafer surface are evenly polished. The gimbal mechanism enables the portion of the pedestal unit holding the semiconductor wafer to precess relative to that portion of the pedestal unit connected to the polishing machine. An elastomeric shim ring is also used within the pedestal unit to provide further compliance of the wafer surface to the various contours of the polishing pad during the polishing process.