Abstract: A connector assembly and method of attaching the same to one or more biosensor module boards. The connector assembly includes a body portion defining a first surface and a second surface opposite the first surface. The connector assembly also includes a coaxial RF connector positioned in the body portion and extending between the first surface and the second surface. The coaxial RF connector includes a ground ring, an RF pin positioned within the ground ring, and dielectric therebetween. The connector assembly is configured to be coupled to an RF detection board such that the coaxial RF connector is operably coupled thereto. The connector assembly is also configured to be connected to a biosensor module board such that the coaxial RF connector is operably connected thereto.

Abstract: A device including at least one sensing bulk acoustic wave (BAW) resonator including a sensing surface; a fluid channel, wherein the sensing surface of the at least one sensing BAW resonator is disposed adjacent to or within the fluid channel; at least one resistive heater; and at least one temperature detector, wherein the at least one temperature detector is configured to monitor the temperature adjacent to the at least one BAW resonator and affect a current to be passed through the at least one resistive heater.

Abstract: A bulk acoustic wave sensor includes a delay layer. The sensor includes an acoustic mirror and a base resonator. The base resonator includes a piezoelectric layer and two electrodes. One or more delay layers are disposed adjacent to the base resonator. A delay layer may be disposed between the base resonator and the acoustic mirror, a delay layer may be disposed on the base resonator opposite to the acoustic mirror, or both. Each delay section is formed of high quality-factor material. The sensor may define a resonant frequency, and the thickness of each delay section may be an integer multiple of half-wavelengths of the resonant frequency.

Abstract: A device including at least one sensing bulk acoustic wave (BAW) resonator including a sensing surface; a fluid channel, wherein the sensing surface of the at least one sensing BAW resonator is disposed adjacent to or within the fluid channel; at least one resistive heater; and at least one temperature detector, wherein the at least one temperature detector is configured to monitor the temperature adjacent to the at least one BAW resonator and affect a current to be passed through the at least one resistive heater.

Abstract: Operational configuration and temperature compensation methods are provided for bulk acoustic wave (BAW) resonator devices suitable for operating with liquids. Temperature compensation methods dispense with a need for temperature sensing, instead utilizing a relationship between (i) change in frequency of a BAW resonator at a phase with adequate sensitivity and (ii) change in frequency of a phase that is correlated to temperature. Operational configuration methods include determination of an initial phase response of a BAW resonator in which temperature coefficient of frequency is zero, followed by comparison of sensitivity to a level of detection threshold for a phenomenon of interest.

Abstract: Operational configuration and temperature compensation methods are provided for bulk acoustic wave (BAW) resonator devices suitable for operating with liquids. Temperature compensation methods dispense with a need for temperature sensing, instead utilizing a relationship between (i) change in frequency of a BAW resonator at a phase with adequate sensitivity and (ii) change in frequency of a phase that is correlated to temperature. Operational configuration methods include determination of an initial phase response of a BAW resonator in which temperature coefficient of frequency is zero, followed by comparison of sensitivity to a level of detection threshold for a phenomenon of interest.

Abstract: A bulk acoustic wave sensor includes a delay layer. The sensor includes an acoustic mirror and a base resonator. The base resonator includes a piezoelectric layer and two electrodes. One or more delay layers are disposed adjacent to the base resonator. A delay layer may be disposed between the base resonator and the acoustic mirror, a delay layer may be disposed on the base resonator opposite to the acoustic mirror, or both. Each delay section is formed of high quality-factor material. The sensor may define a resonant frequency, and the thickness of each delay section may be an integer multiple of half-wavelengths of the resonant frequency.

Abstract: The present disclosure provides an acoustic resonator with reduced mechanical clamping of an active region for enhanced shear mode response. More specifically, the present disclosure provides a solidly mounted BAW resonator device with an active region of piezoelectric material laterally surrounded by an inactive region with a reduced thickness of piezoelectric material such that at least an upper portion of the inactive region along a boundary of the active region is devoid of piezoelectric material. The resonator device provides a discontinuity along opposing lateral edges of the piezoelectric material of the active region to reduce mechanical clamping of the active region in a direction of maximum lateral displacement in shear mode operation. Increasing the mechanical isolation of the active region of piezoelectric material decreases mechanical damping of lateral vibrations of the active region which enhances the shear mode response for quasi-shear mode sensing.

Abstract: A micro-electrical-mechanical system (MEMS) resonator device includes a top side electrode overlaid with a low water permeability hermeticity layer and an interface layer including a material (e.g., gold or a hydroxylated oxide surface) suitable for receiving a self-assembled monolayer (SAM) that may be functionalized with a functionalization (e.g., specific binding) material, with the foregoing layers being designed to have insubstantial impact on sensor performance. Atomic layer deposition may be used for deposition of the hermeticity and/or interface layers. The hermeticity layer protects the electrode material from attack in corrosive liquid environments, and the interface layer facilitates proper chemical binding of the SAM. Sensors and microfluidic devices incorporating MEMS resonator devices are also provided.

Abstract: A solidly mounted resonator structure includes an multi-layer acoustic reflector structure and a piezoelectric material layer arranged between the first and second electrode structures to form an active region, with the acoustic reflector structure providing enhanced reflection of shear and longitudinal modes of acoustic vibrations. The solidly mounted resonator structure is configured for transduction of an acoustic wave including a longitudinal component and a shear component. The acoustic reflector structure includes multiple sequentially arranged differential acoustic impedance layer units each including a low acoustic impedance material layer in contact with a high acoustic impedance material layer. A frequency corresponding to a minimum transmissivity of a second harmonic resonance of a longitudinal response is substantially matched to a frequency corresponding to a minimum transmissivity of a third harmonic resonance of a shear response.

Abstract: Operational configuration and temperature compensation methods are provided for bulk acoustic wave (BAW) resonator devices suitable for operating with liquids. Temperature compensation methods dispense with a need for temperature sensing, instead utilizing a relationship between (i) change in frequency of a BAW resonator at a phase with adequate sensitivity and (ii) change in frequency of a phase that is correlated to temperature. Operational configuration methods include determination of an initial phase response of a BAW resonator in which temperature coefficient of frequency is zero, followed by comparison of sensitivity to a level of detection threshold for a phenomenon of interest.

Abstract: Operational configuration and temperature compensation methods are provided for bulk acoustic wave (BAW) resonator devices suitable for operating with liquids. Temperature compensation methods dispense with a need for temperature sensing, instead utilizing a relationship between (i) change in frequency of a BAW resonator at a phase with adequate sensitivity and (ii) change in frequency of a phase that is correlated to temperature. Operational configuration methods include determination of an initial phase response of a BAW resonator in which temperature coefficient of frequency is zero, followed by comparison of sensitivity to a level of detection threshold for a phenomenon of interest.

Abstract: The present disclosure provides an acoustic resonator with reduced mechanical clamping of an active region for enhanced shear mode response. More specifically, the present disclosure provides a solidly mounted BAW resonator device with an active region of piezoelectric material laterally surrounded by an inactive region with a reduced thickness of piezoelectric material such that at least an upper portion of the inactive region along a boundary of the active region is devoid of piezoelectric material. The resonator device provides a discontinuity along opposing lateral edges of the piezoelectric material of the active region to reduce mechanical clamping of the active region in a direction of maximum lateral displacement in shear mode operation. Increasing the mechanical isolation of the active region of piezoelectric material decreases mechanical damping of lateral vibrations of the active region which enhances the shear mode response for quasi-shear mode sensing.

Abstract: A micro-electrical-mechanical system (MEMS) resonator device includes a top side electrode overlaid with a low water permeability hermeticity layer and an interface layer including a material (e.g., gold or a hydroxylated oxide surface) suitable for receiving a self-assembled monolayer (SAM) that may be functionalized with a functionalization (e.g., specific binding) material, with the foregoing layers being designed to have insubstantial impact on sensor performance. Atomic layer deposition may be used for deposition of the hermeticity and/or interface layers. The hermeticity layer protects the electrode material from attack in corrosive liquid environments, and the interface layer facilitates proper chemical binding of the SAM. Sensors and microfluidic devices incorporating MEMS resonator devices are also provided.

Abstract: A solidly mounted resonator structure includes an multi-layer acoustic reflector structure and a piezoelectric material layer arranged between the first and second electrode structures to form an active region, with the acoustic reflector structure providing enhanced reflection of shear and longitudinal modes of acoustic vibrations. The solidly mounted resonator structure is configured for transduction of an acoustic wave including a longitudinal component and a shear component. The acoustic reflector structure includes multiple sequentially arranged differential acoustic impedance layer units each including a low acoustic impedance material layer in contact with a high acoustic impedance material layer. A frequency corresponding to a minimum transmissivity of a second harmonic resonance of a longitudinal response is substantially matched to a frequency corresponding to a minimum transmissivity of a third harmonic resonance of a shear response.