Patents by Inventor Rick R. Endo

Rick R. Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7836901
    Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: November 23, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Alexander Ko, Rick R. Endo
  • Patent number: 7819985
    Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: October 26, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Alexander Ko, Rick R. Endo
  • Publication number: 20090026150
    Abstract: A method of and apparatus for mixing chemicals in a single wafer process. According to the present invention a chemical is fed into a valve system having a tube of a known volume. The chemical is fed into the valve system to fill the tube with a chemical to generate a measured amount of the chemical. The measured amount of chemical is then used in a single wafer process.
    Type: Application
    Filed: September 17, 2008
    Publication date: January 29, 2009
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Rick R. Endo, Alexander Ko
  • Publication number: 20090020144
    Abstract: An apparatus for wet processing individual substrates comprising; a means for holding the substrate; a means for providing acoustic energy to a non-device side of the substrate; and a means for flowing a fluid onto a device side of the substrate.
    Type: Application
    Filed: September 18, 2008
    Publication date: January 22, 2009
    Inventors: STEVEN VERHAVERBEKE, J. Kelly Truman, Alexander Ko, Rick R. Endo
  • Publication number: 20080314424
    Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
    Type: Application
    Filed: October 26, 2007
    Publication date: December 25, 2008
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Alexander Ko, Rick R. Endo
  • Patent number: 7451774
    Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: November 18, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Alexander Ko, Rick R. Endo
  • Patent number: 7334588
    Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: February 26, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Alexander Ko, Rick R. Endo
  • Patent number: 7290976
    Abstract: According to one aspect of the present invention, a passive substrate gripper, including first and second segments, is provided. The second segment may be connected to the first segment, and the first and second segments may jointly form a substrate support. The substrate support may be shaped to support a substrate in first position within the substrate support when the substrate support is in a first angular orientation. The substrate may be removable from substrate support in a first direction when in the first position. The substrate may move into a second position when the substrate support is moved into a second angular orientation. The substrate may not be removable in the first direction when in the second position within the substrate support. The passive substrate gripper may also include a support ledge extending from opposing inner surfaces of the first and second segments, on which the substrate is supported.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: November 6, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Ralph M. Wadensweiler, Rick R. Endo, Alexander S. Ko
  • Patent number: 7205023
    Abstract: A method of and apparatus for mixing chemicals in a single wafer process. According to the present invention a chemical is fed into a valve system having a tube of a known volume. The chemical is fed into the valve system to fill the tube with a chemical to generate a measured amount of the chemical. The measured amount of chemical is then used in a single wafer process.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: April 17, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Rick R. Endo, Alexander Ko
  • Publication number: 20020075750
    Abstract: A method of and apparatus for mixing chemicals in a single wafer process. According to the present invention a chemical is fed into a valve system having a tube of a known volume. The chemical is fed into the valve system to fill the tube with a chemical to generate a measured amount of the chemical. The measured amount of chemical is then used in a single wafer process.
    Type: Application
    Filed: June 25, 2001
    Publication date: June 20, 2002
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Rick R. Endo, Alexander Ko
  • Publication number: 20020066475
    Abstract: A chuck for holding a wafer that includes a number of moveable clamping arms each pivotally attached to one or more fixed support structures; and a center-of-mass of each of the moveable clamping arms positioned a distance from the pivot point of each of the moveable clamping arms, such that when the chuck is at rest, the number of moveable clamping arms rotate to release a grip on the wafer, and when the chuck is rotating, the clamping arms rotate to grip the wafer.
    Type: Application
    Filed: June 25, 2001
    Publication date: June 6, 2002
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Alexander Ko, Rick R. Endo
  • Publication number: 20020029788
    Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
    Type: Application
    Filed: June 25, 2001
    Publication date: March 14, 2002
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Steven Verhaverbeke, J. Kelly Truman, Alexander Ko, Rick R. Endo