Patents by Inventor Rick Sullivan

Rick Sullivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packages and methods for packaging using a lid having multiple conductive layers
    Patent number: 8723308
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: May 13, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta