Patents by Inventor Ricki Dee Williams

Ricki Dee Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9414496
    Abstract: Implementations of the present disclosure involve an apparatus and/or method for a large array of AC coupling/DC blocking capacitors on a printed circuit board (PCB) of a microelectronic circuit. The method provides for the placement of the blocking capacitors (and associated vias) to be placed on/through the PCB in a small area while yielding low crosstalk or interference between the vias. In one particular embodiment, the blocking capacitors are placed on the PCB in an alternating pattern, with a pair of blocking capacitors placed on the top side of the PCB followed by a pair of blocking capacitors on the bottom side of the PCB, and so on. Further, top side capacitor vias may be back-drilled from the bottom side and bottom side capacitor vias may be back-drilled from the top side.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: August 9, 2016
    Assignee: Oracle International Corporation
    Inventors: Ricki Dee Williams, Ray Ping-kwan Chan
  • Publication number: 20160183373
    Abstract: Implementations of the present disclosure involve an apparatus and/or method for a large array of AC coupling/DC blocking capacitors on a printed circuit board (PCB) of a microelectronic circuit. The method provides for the placement of the blocking capacitors (and associated vias) to be placed on/through the PCB in a small area while yielding low crosstalk or interference between the vias. In one particular embodiment, the blocking capacitors are placed on the PCB in an alternating pattern, with a pair of blocking capacitors placed on the top side of the PCB followed by a pair of blocking capacitors on the bottom side of the PCB, and so on. Further, top side capacitor vias may be back-drilled from the bottom side and bottom side capacitor vias may be back-drilled from the top side.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 23, 2016
    Applicant: Oracle International Corporation
    Inventors: Ricki Dee Williams, Ray Ping-kwan Chan
  • Patent number: 7287187
    Abstract: The present invention provides a method and apparatus for supplying redundant power. The apparatus includes a first power supply adapted to provide a first portion of power. The apparatus further includes a second power supply adapted to provide a second portion of power and a distribution network, wherein the distribution network is adapted to direct the first portion of power and the second portion of power to a first split path adapted to transmit signals in a system.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: October 23, 2007
    Assignee: Sun Microsystems, Inc.
    Inventors: Ricki Dee Williams, Gary L. Gilbert
  • Publication number: 20030223352
    Abstract: A method and system for reducing forward crosstalk using time division multiplexing of the crosstalk noise. The method includes routing a plurality of signal lines along generally parallel paths and spacing one or more groups of the plurality of signal lines unequally in a neck in and a neck out configuration so that adjacent signal lines in each of the one or more groups of the plurality of signal lines extend away from each other within a predetermined distance. The method may also include terminating each of the plurality of signal lines using active termination. The method may also include establishing a single strip line stack up.
    Type: Application
    Filed: May 29, 2002
    Publication date: December 4, 2003
    Inventor: Ricki Dee Williams
  • Publication number: 20030074586
    Abstract: The present invention provides a method and apparatus for supplying redundant power. The apparatus includes a first power supply adapted to provide a first portion of power. The apparatus further includes a second power supply adapted to provide a second portion of power and a distribution network, wherein the distribution network is adapted to direct the first portion of power and the second portion of power to a first split path adapted to transmit signals in a system.
    Type: Application
    Filed: October 15, 2001
    Publication date: April 17, 2003
    Inventors: Ricki Dee Williams, Gary L. Gilbert