Abstract: A method for forming curved image sensors may include applying positive pressure to the face of an image sensor, forcing the image sensor to adhere the curved surface of a substrate. The pressure may be applied to the face of the image sensor in a variety of ways, including using pneumatic pressure, hydraulic pressure, or pressure from an elastic or inelastic solid. Processing may occur on either a single image sensor die or an image sensor wafer. When an image sensor wafer is processed, a substrate may be used that has a number of cavities defined by respective curved surfaces with each cavity corresponding to a respective image sensor. When pressure is applied to the image sensor, the image sensor may deform until the curvature of the image sensor matches the curvature of the curved surface of the underlying substrate.

Abstract: A method for forming curved image sensors may include applying positive pressure to the face of an image sensor, forcing the image sensor to adhere the curved surface of a substrate. The pressure may be applied to the face of the image sensor in a variety of ways, including using pneumatic pressure, hydraulic pressure, or pressure from an elastic or inelastic solid. Processing may occur on either a single image sensor die or an image sensor wafer. When an image sensor wafer is processed, a substrate may be used that has a number of cavities defined by respective curved surfaces with each cavity corresponding to a respective image sensor. When pressure is applied to the image sensor, the image sensor may deform until the curvature of the image sensor matches the curvature of the curved surface of the underlying substrate.

Abstract: Various methods, apparatuses, and systems in which an alignment tool holds an optical fiber and an optical alignment component in place during induction soldering. The alignment tool has alignment adjustments for the optical fiber as well as the optical alignment component. An induction soldering station induction solders the optical fiber to the optical alignment component in order to secure the optical fiber to the optical alignment component.

Abstract: Various methods, apparatuses, and systems in which an alignment tool holds an optical fiber and an optical alignment component in place during induction soldering. The alignment tool has alignment adjustments for the optical fiber as well as the optical alignment component. An induction soldering station induction solders the optical fiber to the optical alignment component in order to secure the optical fiber to the optical alignment component.

Abstract: A polymer based circuit production method provides a polymer based circuit by exposing a surface of a polymer substrate to ultraviolet radiation resulting in an adhesion promoted polymer substrate surface. A circuit is fabricated on the polymer substrate surface and a coating material is applied to at least a portion of the adhesion promoted polymer substrate surface. A portion of the circuit fabricated on the polymer substrate surface may be encapsulated. The polymer based circuit resulting from the method includes a polymer substrate having an ultraviolet radiation treated surface, a circuit formed on the polymer substrate surface, and a coating material encapsulating at least a portion of the at least one circuit between the polymer substrate and the coating material.

Abstract: A polymer based circuit production method provides a polymer based circuit by exposing a surface of a polymer substrate to ultraviolet radiation resulting in an adhesion promoted polymer substrate surface. A circuit is fabricated on the polymer substrate surface and a coating material is applied to at least a portion of the adhesion promoted polymer substrate surface. A portion of the circuit fabricated on the polymer substrate surface may be encapsulated. The polymer based circuit resulting from the method includes a polymer substrate having an ultraviolet radiation treated surface, a circuit formed on the polymer substrate surface, and a coating material encapsulating at least a portion of the at least one circuit between the polymer substrate and the coating material.