Abstract: Methods and apparatuses for releasably attaching microfeature workpieces to support members are disclosed herein. In one embodiment, a method includes applying a first material to a first region on a first side of a microfeature workpiece. The method then includes releasably attaching the first side of the workpiece to a support member. The method further includes applying a second material to a second region on the first side of the workpiece. The second region includes a perimeter portion of the workpiece. The first material and/or the second material can be an adhesive. The second material is removable from the workpiece relative to the first material. In several embodiments, for example, the first material can have a first solubility in a solution and the second material can have a second solubility in the solution less than the first solubility.

Abstract: Methods for forming a via and a conductive path are disclosed. The methods include forming a via within a wafer with cyclic etch/polymer phases, followed by an augmented etch phase. The resulting via may include a first portion having a substantially uniform cross section and a second portion in the form of a hollow ball, extending laterally further within the wafer than the first portion. Backgrinding the wafer to the second portion of the via may create a vent. A conductive path may be formed by filling the via with a conductive material, such as solder. Flux gases may escape through the vent. The wafer surrounding the second portion of the via may be removed, exposing a conductive element in the shape of a ball, the shape of the second portion of the via. Semiconductor devices including the conductive paths of the present invention are also disclosed.

Abstract: Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web.

Abstract: Methods and apparatuses for releasably attaching microfeature workpieces to support members are disclosed herein. In one embodiment, a method includes applying a first material to a first region on a first side of a microfeature workpiece. The method then includes releasably attaching the first side of the workpiece to a support member. The method further includes applying a second material to a second region on the first side of the workpiece. The second region includes a perimeter portion of the workpiece. The first material and/or the second material can be an adhesive. The second material is removable from the workpiece relative to the first material. In several embodiments, for example, the first material can have a first solubility in a solution and the second material can have a second solubility in the solution less than the first solubility.

Abstract: A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: A method used to form a semiconductor device comprises processing a semiconductor wafer to include one or more vias or through-holes only partially etched into the wafer, and scribe marks only partially etched into the wafer which define a plurality of semiconductor devices. Wafer material is removed from the back of the wafer to the level of the vias and scribe marks to form a via opening through the wafer while simultaneously dicing the wafer into individual semiconductor dice.

Abstract: Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web.

Abstract: A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: A hermetically sealable package may be formed from a top portion and a bottom portion mated along a seam at or near a plane of an optical fiber. A completed pill assembly may be positioned directly into the enclosure base without requiring the fiber to be threaded through the feed through or “snout”. The top potion may then be mated with the bottom portion to form the package. A glass solder ring may be placed coaxial with the fiber in the feed through. The seam may be sealed by laser welding and the glass solder ring reflowed by laser heating, for example, with a same laser as used to weld the seam or by resistive or induction heating. In some embodiments a coupling tube around the fiber and snout or the snout itself may have holes to allow solder sealing within the snout and filling the remaining area with epoxy. Since the package is initially split in two pieces, module assembly may be facilitated without threading.

Abstract: A method of forming a button-type battery, includes: a) providing an electrically conductive sheet having an exposed surface which is divisible into a plurality of areas; b) depositing an uncured electrically insulative gasket material onto the conductive sheet into a plurality of the areas, the gasket material being deposited to define at least one discrete pattern within the respective deposited areas, the respective discrete patterns covering less than a total of their respective areas; c) curing the deposited gasket material; d) cutting and forming a plurality of discrete first terminal housing members from the areas of the conductive sheet, the respective first terminal housing members comprising at least a portion of one of the discrete patterns of gasket material; d) providing a discrete electrically conductive second terminal housing member in facing juxtaposition to one of the first terminal housing members; e) providing an anode and a cathode having a separator and electrolyte positioned therebetwee

Abstract: A method of forming a button-type battery includes: a) providing an electrically conductive sheet having an exposed surface which is divisible into a plurality of areas; b) depositing an uncured electrically insulative gasket material onto the conductive sheet into a plurality of the areas, the gasket material being deposited to define at least one discrete pattern within the respective deposited areas, the respective discrete patterns covering less than a total of their respective areas; c) curing the deposited gasket material; d) cutting and forming a plurality of discrete first terminal housing members from the areas of the conductive sheet, the respective first terminal housing members comprising at least a portion of one of the discrete patterns of gasket material; d) providing a discrete electrically conductive second terminal housing member in facing juxtaposition to one of the first terminal housing members; e) providing an anode and a cathode having a separator and electrolyte positioned therebetween