Patents by Inventor RICKY AGRAWAL

RICKY AGRAWAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER LEVEL PACKAGING WITH HEAT DISSIPATION
    Publication number: 20110233756
    Abstract: A heat dissipating wafer level package and method for manufacturing a heat dissipating wafer level package is provided. The heat dissipating wafer level package has a thermally conductive coating integrated thereon which facilitates the dissipation of heat from a device into the surrounding air and/or the thermal transfer of heat away from the device toward a heat spreader or heat sink. Additionally, the coating enhances the structural integrity and strength of the wafer during the manufacturing process as well as the resulting WLP.
    Type: Application
    Filed: March 24, 2010
    Publication date: September 29, 2011
    Applicant: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: VIREN KHANDEKAR, ARKADII SAMOILOV, DUANE WILCOXEN, RICKY AGRAWAL