Patents by Inventor Ricky Donald HECKLER

Ricky Donald HECKLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly in place method and apparatus
    Patent number: 11600903
    Abstract: In the present invention a guide or carrier is used to assemble and position multiple AiPs (or Integrated Circuit packages) on a substrate and maintain spacing therebetween. In some examples, this reduces package size and maintains desired tolerances. The carrier or guard is to be thin and flexible so as to allow some movement but maintain tolerances at specific locations.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: March 7, 2023
    Assignee: METAWAVE Corporation
    Inventors: Soren Shams, Ricky Donald Heckler, Raul Inocencio Alidio, Taha Shahvirdi Dizaj Yekan
  • ASSEMBLY IN PLACE METHOD AND APPARATUS
    Publication number: 20210384610
    Abstract: In the present invention a guide or carrier is used to assemble and position multiple AiPs (or Integrated Circuit packages) on a substrate and maintain spacing therebetween. In some examples, this reduces package size and maintains desired tolerances. The carrier or guard is to be thin and flexible so as to allow some movement but maintain tolerances at specific locations.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 9, 2021
    Inventors: Soren SHAMS, Ricky Donald HECKLER, Raul Inocencio ALIDIO, Taha SHAHVIRDI DIZAJ YEKAN