Patents by Inventor Ricky Jackson
Ricky Jackson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240102830Abstract: Barrier layers for anisotropic magneto-resistive (AMR) sensors integrated with semiconductor circuits and methods of making the same are described. The AMR sensors includes a NiFe alloy layer disposed over a dielectric layer. The NiFe alloy layer is in contact with a conductive via coupled to the semiconductor circuits in a substrate underneath the AMR sensor. A barrier layer is formed on the dielectric layer to prevent Ni or Fe atoms from diffusing through the dielectric layer toward the semiconductor circuits. Further, a sacrificial layer is used to facilitate forming a planarized surface with ends of the conductive vias exposed without compromising the barrier layer.Type: ApplicationFiled: December 28, 2022Publication date: March 28, 2024Inventors: Fuchao Wang, William French, Ricky A. Jackson, Erika Mazotti
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Publication number: 20230301380Abstract: A finger warming apparatus that is configured to receive four human fingers therein wherein the present invention is configured to be inserted into a pocket or mitten and have fingers journaled thereinto. The finger warming apparatus includes a body wherein the body is formed utilizing a lower wall and an upper wall. The lower wall and upper wall are joined along an outer perimeter edge so as to form a cavity being of suitable size to accommodate four human fingers therein. The body includes an opening providing access to the cavity. The body is formed such that the lower wall has a length that is less than that of the length of an upper wall so as to provide a desired fit and inhibit interference from the palm of the user. The body is manufactured from cloth and includes heating elements disposed in the upper wall and lower wall.Type: ApplicationFiled: March 23, 2022Publication date: September 28, 2023Inventor: Ricky Jackson-Lewis
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Publication number: 20230246630Abstract: In some examples, a device includes a substrate, an oxide layer, and a resonator structure. The substrate is configured in a released-resonator architecture. The substrate has a first surface that is a roughened first surface and a second surface opposite to the first surface. The second surface exposed to a cavity of the released-resonator architecture.Type: ApplicationFiled: January 31, 2022Publication date: August 3, 2023Inventors: Keegan Shaun MARTIN, Ricky A. JACKSON, Ting-Ta YEN, Huiyao CHEN
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Publication number: 20230116851Abstract: A device for pumping fluid such as paints, sealants, caulks, and polymers made of a rotor assembly and a pump body. The rotor assembly contains at least one laminar flow element arranged in such a manner as to conduct the fluid from inlet to outlet as the rotor spins. The rotor may vary its distance from the pump body. This arrangement provides a rotor with exceptional capacity to pump without damage to the fluid media and to measure the fluid rate at low or high rotational speed with viscosity that can vary. The device also may provide a spray nozzle or nozzles that produce a multiplicity of spray patterns.Type: ApplicationFiled: September 10, 2021Publication date: April 13, 2023Inventors: John LLoyd Bowman, Ricky Jackson, Bryan Killeen
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Publication number: 20230006635Abstract: An integrated circuit (IC) resonator module for an IC package includes an acoustic resonator having a surface and a Bragg reflector adhered to the surface of the acoustic resonator. The Bragg reflector includes low impedance layers formed of a first material with a first acoustic impedance and a high impedance layer formed of a second material with a second acoustic impedance. The second acoustic impedance is greater than the first acoustic impedance. The Bragg reflector further includes a Bragg grating layer formed of randomly or periodically spaced patches of the second material separated by vias filled with the first material.Type: ApplicationFiled: June 30, 2021Publication date: January 5, 2023Inventors: Huiyao Chen, Ting-Ta Yen, Ricky A. Jackson, Martin Keegan
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Patent number: 11417725Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: GrantFiled: November 25, 2020Date of Patent: August 16, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Patent number: 11387782Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.Type: GrantFiled: January 6, 2021Date of Patent: July 12, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Ricky A. Jackson, Kurt Peter Wachtler
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Publication number: 20210343884Abstract: An integrated circuit that includes a substrate, a photodiode, and a Fresnel structure. The photodiode is formed on the substrate, and it has a p-n junction. The Fresnel structure is formed above the photodiode, and it defines a focal zone that is positioned within a proximity of the p-n junction. In one aspect, the Fresnel structure may include a trench pattern that functions as a diffraction means for redirecting and concentrating incident photons to the focal zone. In another aspect, the Fresnel structure may include a wiring pattern that functions as a diffraction means for redirecting and concentrating incident photons to the focal zone. In yet another aspect, the Fresnel structure may include a transparent dielectric pattern that functions as a refractive means for redirecting and concentrating incident photons to the focal zone.Type: ApplicationFiled: July 15, 2021Publication date: November 4, 2021Inventors: Debarshi Basu, Henry Litzmann Edwards, Ricky A. Jackson, Marco A. Gardner
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Patent number: 11148939Abstract: An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens. The apparatus further includes at least one stress compensation ring over a portion of the lens material and over at least a portion of the piezoelectric capacitor. The at least one stress compensation ring is configured to at least partially reduce bending of the lens material caused by stress on or in the lens material.Type: GrantFiled: February 7, 2018Date of Patent: October 19, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: YungShan Chang, Ricky A. Jackson, Jeff W. Ritchison, Neng Jiang
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Patent number: 11146230Abstract: A method for creating a double Bragg mirror is provided. The method comprises providing a wafer having a plurality of bulk acoustic wave (BAW) devices at an intermediate stage of manufacturing. A first dielectric layer is deposited over the wafer. A plurality of as-deposited thicknesses of the dielectric layer are determined, each as-deposited thickness corresponding to one BAW device from the plurality of BAW devices. A corresponding trimmed dielectric layer over each of the BAW devices is formed by removing a portion of the dielectric layer over each of the BAW devices, with a thickness of the removed portion determined from a corresponding as-deposited thickness and a target thickness. A Bragg acoustic reflector that includes the corresponding trimmed dielectric layer is formed over each of the BAW devices.Type: GrantFiled: August 28, 2019Date of Patent: October 12, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Nicholas S Dellas, Brian Goodlin, Ricky Jackson
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Patent number: 11094837Abstract: An integrated circuit that includes a substrate, a photodiode, and a Fresnel structure. The photodiode is formed on the substrate, and it has a p-n junction. The Fresnel structure is formed above the photodiode, and it defines a focal zone that is positioned within a proximity of the p-n junction. In one aspect, the Fresnel structure may include a trench pattern that functions as a diffraction means for redirecting and concentrating incident photons to the focal zone. In another aspect, the Fresnel structure may include a wiring pattern that functions as a diffraction means for redirecting and concentrating incident photons to the focal zone. In yet another aspect, the Fresnel structure may include a transparent dielectric pattern that functions as a refractive means for redirecting and concentrating incident photons to the focal zone.Type: GrantFiled: December 7, 2018Date of Patent: August 17, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Debarshi Basu, Henry Litzmann Edwards, Ricky A. Jackson, Marco A. Gardner
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Publication number: 20210126585Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.Type: ApplicationFiled: January 6, 2021Publication date: April 29, 2021Inventors: Ricky A. Jackson, Kurt Peter Wachtler
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Publication number: 20210083047Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: ApplicationFiled: November 25, 2020Publication date: March 18, 2021Inventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Publication number: 20210067126Abstract: A method for creating a double Bragg mirror is provided. The method comprises providing a wafer having a plurality of bulk acoustic wave (BAW) devices at an intermediate stage of manufacturing. A first dielectric layer is deposited over the wafer. A plurality of as-deposited thicknesses of the dielectric layer are determined, each as-deposited thickness corresponding to one BAW device from the plurality of BAW devices. A corresponding trimmed dielectric layer over each of the BAW devices is formed by removing a portion of the dielectric layer over each of the BAW devices, with a thickness of the removed portion determined from a corresponding as-deposited thickness and a target thickness. A Bragg acoustic reflector that includes the corresponding trimmed dielectric layer is formed over each of the BAW devices.Type: ApplicationFiled: August 28, 2019Publication date: March 4, 2021Inventors: Nicholas S. Dellas, Brian Goodlin, Ricky Jackson
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Patent number: 10892712Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.Type: GrantFiled: January 21, 2020Date of Patent: January 12, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Ricky A. Jackson, Kurt Peter Wachtler
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Patent number: 10854712Abstract: An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.Type: GrantFiled: February 4, 2019Date of Patent: December 1, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dan Carothers, Ricky Jackson, Rajarshi Mukhopadhyay, Ben Cook
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Patent number: 10829365Abstract: A piezoelectric optical micro-electro-mechanical systems (POMEMS) device includes a glass layer having a first surface and an opposite second surface. The device may also include a first moisture barrier layer having a first surface and an opposite second surface in which the second surface of the first moisture barrier layer is substantially coextensive with and interfaces with the first surface of the glass layer. A piezo stack may be attached on the first side of the first moisture barrier layer. The device may also include a second moisture barrier layer having a first surface and an opposite second surface. The first surface of the second moisture barrier is substantially coextensive with and interfaces with the second surface of the glass layer. A semiconductor substrate may be attached on the second side of the second moisture barrier layer.Type: GrantFiled: November 3, 2017Date of Patent: November 10, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: YungShan Chang, Ricky A. Jackson
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Publication number: 20200153387Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.Type: ApplicationFiled: January 21, 2020Publication date: May 14, 2020Inventors: Ricky A. Jackson, Kurt Peter Wachtler
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Patent number: 10574184Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.Type: GrantFiled: May 1, 2018Date of Patent: February 25, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Ricky A Jackson, Kurt Peter Wachtler
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Publication number: 20190341885Abstract: A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.Type: ApplicationFiled: May 1, 2018Publication date: November 7, 2019Inventors: RICKY A. JACKSON, KURT PETER WACHTLER