Patents by Inventor Ricky L. Boston

Ricky L. Boston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for back side damage of silicon wafers
    Patent number: 5197271
    Abstract: A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers during the processing and allows the wafer to be rotated during processing if desired.
    Type: Grant
    Filed: March 22, 1981
    Date of Patent: March 30, 1993
    Assignee: Texas Instruments Incorporated
    Inventors: John Robbins, Ricky L. Boston
  • Method for backside damage of silicon wafers
    Patent number: 5006475
    Abstract: A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers during the processing and allows the wafer to be rotated during processing if desired.
    Type: Grant
    Filed: July 12, 1989
    Date of Patent: April 9, 1991
    Assignee: Texas Instruments Incorporated
    Inventors: John Robbins, Ricky L. Boston