Patents by Inventor Ricky Lee Sturdivant

Ricky Lee Sturdivant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9277643
    Abstract: An electrical interconnect has a non-planar ceramic substrate with opposing first and second ends. A first conductive layer having first and second opposing sides is disposed within the ceramic substrate with one of the first and second opposing sides exposed at the first end and one of the first and second opposing sides exposed at the second end. The electrical interconnect is useful to join an integrated circuit in a hybrid package to a circuit board in high frequency communication applications.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: March 1, 2016
    Assignee: Ametek Aegis
    Inventors: Kenneth G. McGillivray, Ricky Lee Sturdivant
  • Publication number: 20160007448
    Abstract: An electrical interconnect has a non-planar ceramic substrate with opposing first and second ends. A first conductive layer having first and second opposing sides is disposed within the ceramic substrate with one of the first and second opposing sides exposed at the first end and one of the first and second opposing sides exposed at the second end. The electrical interconnect is useful to join an integrated circuit in a hybrid package to a circuit board in high frequency communication applications.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 7, 2016
    Applicant: AMETEK AEGIS
    Inventors: Kenneth G. McGillivray, Ricky Lee Sturdivant