Abstract: A device for producing and removing an internal contour from a planar substrate comprising: a beam-producing- and beam-forming arrangement which is configured to perform: a contour definition step wherein a laser beam is guided over the substrate to produce a plurality of individual zones of internal damage in a substrate material along a contour line defining the internal contour; a crack deformation step, wherein the laser beam is guided over the substrate and produces a plurality of individual zones of internal damage in the substrate material to form a plurality of crack line portions that lead away from the contour line into the internal contour; and a material removal-step, wherein a laser beam directed towards the substrate surface that inscribes a removal line through a thickness of the substrate at the internal contour causes the internal contour to detach from the substrate.

Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.

Abstract: The present invention relates to a method for laser-based machining of a planar, crystalline substrate in order to separate the substrate into a plurality of parts, in which the laser beam of a laser is directed, for machining the substrate, onto the latter, in which, with an optical arrangement positioned in the beam path of the laser, a laser beam focal surface which is expanded, viewed both along the beam direction and viewed in precisely a first direction perpendicular to the beam direction, but is not expanded in a second direction which is both perpendicular to the first direction and to the beam direction, is formed from the laser beam radiated onto said arrangement on the beam output side of the optical arrangement, the substrate being positioned relative to the laser beam focal surface such that the laser beam focal surface in the interior of the substrate, along an expanded surface portion of the substrate material, produces an induced absorption by means of which crack formations in the substrate m

Abstract: A device for producing and removing an internal contour from a planar substrate comprising: a beam-producing- and beam-forming arrangement which is configured to perform: a contour definition step wherein a laser beam is guided over the substrate to produce a plurality of individual zones of internal damage in a substrate material along a contour line defining the internal contour; a crack deformation step, wherein the laser beam is guided over the substrate and produces a plurality of individual zones of internal damage in the substrate material to form a plurality of crack line portions that lead away from the contour line into the internal contour; and a material removal-step, wherein a laser beam directed towards the substrate surface that inscribes a removal line through a thickness of the substrate at the internal contour causes the internal contour to detach from the substrate.

Abstract: The present invention relates to a method for producing a contour in a planar substrate and for separating the contour from the substrate, in particular for producing an internal contour in a planar substrate and for removing the internal contour from the substrate, wherein, in a contour definition step by means of a laser beam guided over the substrate along a contour line characterizing the contour to be produced, a large number of individual zones of internal damage is produced in the substrate material, in a crack definition step by means of a laser beam guided over the substrate along a plurality of crack line portions, which, viewed from the contour line, leads away at an angle a>0°, and into the contour to be separated, respectively a large number of individual zones of internal damage is produced in the substrate material and, in a material removal step implemented after the contour definition step and after the crack definition step by means of a material-removing laser beam guided over the substr

Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.

Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.

Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.

Abstract: The present invention relates to a method for laser-based machining of a planar, crystalline substrate in order to separate the substrate into a plurality of parts, in which the laser beam of a laser is directed, for machining the substrate, onto the latter, in which, with an optical arrangement positioned in the beam path of the laser, a laser beam focal surface which is expanded, viewed both along the beam direction and viewed in precisely a first direction perpendicular to the beam direction, but is not expanded in a second direction which is both perpendicular to the first direction and to the beam direction, is formed from the laser beam radiated onto said arrangement on the beam output side of the optical arrangement, the substrate being positioned relative to the laser beam focal surface such that the laser beam focal surface in the interior of the substrate, along an expanded surface portion of the substrate material, produces an induced absorption by means of which crack formations in the substrate m

Abstract: The present invention relates to a method for producing a contour in a planar substrate and for separating the contour from the substrate, in particular for producing an internal contour in a planar substrate and for removing the internal contour from the substrate, wherein, in a contour definition step by means of a laser beam guided over the substrate along a contour line characterising the contour to be produced, a large number of individual zones of internal damage is produced in the substrate material, in a crack definition step by means of a laser beam guided over the substrate along a plurality of crack line portions, which, viewed from the contour line, leads away at an angle a >0° , and into the contour to be separated, respectively a large number of individual zones, . . .