Patents by Inventor Ridvan A. Sahan
Ridvan A. Sahan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420338Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.Type: ApplicationFiled: March 6, 2021Publication date: December 28, 2023Inventors: Prabhakar SUBRAHMANYAM, Tong Wa CHAO, Ying-Feng PANG, Yi XIA, Rahima K. MOHAMMED, Victor P. POLYANKO, Ridvan A. SAHAN, Guangying ZHANG, Guoliang YING, Chuanlou WANG, Jun LU, Liguang DU, Peng WEI, Xiang QUE
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Publication number: 20220077023Abstract: An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.Type: ApplicationFiled: November 12, 2021Publication date: March 10, 2022Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Ridvan A. SAHAN
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Patent number: 10930575Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package.Type: GrantFiled: September 30, 2016Date of Patent: February 23, 2021Assignee: Intel CorporationInventors: Prabhakar Subrahmanyam, Tong W. Chao, Stephanie L. Seaman, Ridvan A. Sahan, Ying-Feng Pang
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Publication number: 20200027808Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package.Type: ApplicationFiled: September 30, 2016Publication date: January 23, 2020Inventors: Prabhakar SUBRAHMANYAM, Tong W. CHAO, Stephanie L. SEAMAN, Ridvan A. SAHAN, Ying-Feng PANG
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Patent number: 10198333Abstract: An apparatus and method is described herein for providing a test, validation, and debug architecture. At a target or base level, hardware hooks (Design for Test or DFx) are designed into and integrated with silicon parts. A controller may provide abstracted access to such hooks, such as through an abstraction layer that abstracts low level details of the hardware DFx. In addition, the abstraction layer through an interface, such as APIs, provides services, routines, and data structures to higher-level software/presentation layers, which are able to collect test data for validation and debug of a unit/platform under test. Moreover, the architecture potentially provides tiered (multiple levels of) secure access to the test architecture. Additionally, physical access to the test architecture for a platform may be simplified through use of a unified, bi-directional test access port, while also potentially allowing remote access to perform remote test and debug of a part/platform under test.Type: GrantFiled: December 23, 2010Date of Patent: February 5, 2019Assignee: INTEL CORPORATIONInventors: Mark B. Trobough, Keshavan K. Tiruvallur, Chinna B. Prudvi, Christian E. Iovin, David W. Grawrock, Jay J. Nejedlo, Ashok N. Kabadi, Travis K. Goff, Evan J. Halprin, Kapila B. Udawatta, Jiun Long Foo, Wee Hoo Cheah, Vui Yong Liew, Selvakumar Raja Gopal, Yuen Tat Lee, Samie B. Samaan, Kip C. Killpack, Neil Dobler, Nagib Z. Hakim, Brian Meyer, William H. Penner, John L. Baudrexl, Russell J. Wunderlich, James J. Grealish, Kyle Markley, Timothy S. Storey, Loren J. McConnell, Lyle E. Cool, Mukesh Kataria, Rahima K. Mohammed, Tieyu Zheng, Yi Amy Xia, Ridvan A. Sahan, Arun R. Ramadorai, Priyadarsan Patra, Edwin E. Parks, Abhijit Davare, Padmakumar Gopal, Bruce Querbach, Hermann W. Gartler, Keith Drescher, Sanjay S. Salem, David C. Florey
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Publication number: 20150127983Abstract: An apparatus and method is described herein for providing a test, validation, and debug architecture. At a target or base level, hardware (Design for Test or DFx) are designed into and integrated with silicon parts. A controller may provide abstracted access to such hooks, such as through an abstraction layer that abstracts low level details of the hardware DFx. In addition, the abstraction layer through an interface, such as APIs, provides services, routines, and data structures to higher-level software/presentation layers, which are able to collect test data for validation and debug of a unit/platform under test. Moreover, the architecture potentially provides tiered (multiple levels of) secure access to the test architecture. Additionally, physical access to the test architecture for a platform may be simplified through use of a unified, bi-directional test access port, while also potentially allowing remote access to perform remote test and de-bug of a part/platform under test.Type: ApplicationFiled: December 23, 2010Publication date: May 7, 2015Applicant: INTEL CORPORATIONInventors: Mark B. Trobough, Keshavan K. Tiruvallur, Chinna B. Prudvi, Christian E. Iovin, David W. Grawrock, Jay J. Nejedlo, Ashok N. Kabadi, Travis K. Goff, Evan J. Halprin, Kapila B. Udawatta, Jiun Long Foo, Wee Hoo Cheah, Vui Yong Liew, Selvakumar Raja Gopal, Yuen Tat Lee, Samie B. Samaan, Kip C. Killpack, Neil Dobler, Nagib Z. Hakim, Briar Meyer, William H. Penner, John L. Baudrexl, Russell J. Wunderlich, James J. Grealish, Kyle Markley, Timothy S. Storey, Loren J. McConnell, Lyle E. Cool, Mukesh Kataria, Rahima K. Mohammed, Tieyu Zheng, Yi Amy Xia, Ridvan A. Sahan, Arun R. Ramadorai, Priyadarsan Patra, Edwin E. Parks, Abhijit Davare, Padmakumar Gopal, Bruce Querbach, Hermann W. Gartler, Keith Drescher, Sanjay S. Salem, David C. Florey
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Patent number: 8382503Abstract: The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets.Type: GrantFiled: December 17, 2010Date of Patent: February 26, 2013Assignee: Intel CorporationInventors: Aslam H. Haswarey, Mustafa H. Haswarey, Ridvan A. Sahan, Rahima K. Mohammed
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Publication number: 20120156913Abstract: The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets.Type: ApplicationFiled: December 17, 2010Publication date: June 21, 2012Inventors: Aslam H. Haswarey, Mustafa H. Haswarey, Ridvan A. Sahan, Rahima K. Mohammed