Patents by Inventor Ridza Effendi ABD RAZAK

Ridza Effendi ABD RAZAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible packaging architecture
    Patent number: 10396038
    Abstract: A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: August 27, 2019
    Assignee: Intel Corporation
    Inventors: Bok Eng Cheah, Jackson Chung Peng Kong, Shanggar Periaman, Michael Skinner, Yen Hsiang Chew, Kheng Tat Mar, Ridza Effendi Abd Razak, Kooi Chi Ooi
  • FLEXIBLE PACKAGING ARCHITECTURE
    Publication number: 20170345763
    Abstract: A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
    Type: Application
    Filed: September 26, 2014
    Publication date: November 30, 2017
    Inventors: Bok Eng CHEAH, Jackson Chung Peng KONG, Shanggar PERIAMAN, Michael SKINNER, Yen Hsiang CHEW, Kheng Tat MAR, Ridza Effendi ABD RAZAK, Kooi Chi OOI