Patents by Inventor Ridzuan Hanapi

Ridzuan Hanapi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220157640
    Abstract: A semiconductor wafer transfer arm includes, in one embodiment, a mechanical arm and a contact pad including contact points. The contact points are configured to secure a semiconductor wafer at a non-active area of the semiconductor wafer and offset the contact pad from an active area of the semiconductor wafer by a predetermined distance. The transfer arm prevents foreign material from contacting the wafer and thus reduces instances of die cracking caused by foreign material during a semiconductor wafer transfer process.
    Type: Application
    Filed: June 29, 2021
    Publication date: May 19, 2022
    Inventors: Ridzuan Hanapi, Muhammad Alif Shafiq Arof, Marc Jan Apilado
  • Publication number: 20220020705
    Abstract: A semiconductor wafer thinned by a stealth lasing process, and semiconductor dies formed therefrom. After formation of an integrated circuit layer on a semiconductor wafer, the wafer may be thinned by focusing a laser at discrete points in the wafer substrate beneath the surface of the wafer. Upon completion of stealth lasing in one or more planar layers in the substrate, a portion of the substrate may be removed, leaving the wafer thinned to a desired final thickness.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 20, 2022
    Applicant: Western Digital Technologies, Inc.
    Inventors: Chee Keong Loh, Foo You Chow, Ridzuan Hanapi, Boon Soo Lim