Patents by Inventor Rie HARADA

Rie HARADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11987533
    Abstract: A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: May 21, 2024
    Assignee: IHI Corporation
    Inventors: Rie Harada, Yousuke Mizokami, Takahiko Shinohara, Shinji Muto
  • Patent number: 11498145
    Abstract: A welding method of a diffusion bonded structure in which the diffusion bonded structure formed by diffusion bonding metal parts to each other is bonded to another part by fusion welding includes a buffer layer forming step of forming a buffer layer in a welding region including a diffusion bonded joint of the diffusion bonded structure, the buffer layer having greater ductility than the diffusion bonded joint, and a welding step of bonding the welding region in which the buffer layer is formed to the another part by performing the fusion welding from above the buffer layer.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: November 15, 2022
    Assignee: IHI CORPORATION
    Inventors: Kunitaka Masaki, Rie Harada, Nagisa Hosoya, Takaaki Matsuoka, Yutaka Mizo
  • Publication number: 20210162532
    Abstract: A method of bonding metal members includes a stacked body forming step of forming a stacked body by putting an insert material between a first metal member and a second metal member formed of carbide-containing Ni alloys or carbide-containing Fe alloys, and a solid phase diffusion bonding step of forming a metal member joint body by heating and pressurizing the stacked body to perform solid phase diffusion bonding, wherein the insert material contains Ni having a content higher than an Ni content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Ni alloys, and contains Fe or Ni having a content higher than an Fe content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Fe alloys.
    Type: Application
    Filed: January 19, 2021
    Publication date: June 3, 2021
    Applicant: IHI CORPORATION
    Inventors: Nagisa HOSOYA, Rie HARADA, Keiji KUBUSHIRO
  • Publication number: 20190337078
    Abstract: A welding method of a diffusion bonded structure in which the diffusion bonded structure formed by diffusion bonding metal parts to each other is bonded to another part by fusion welding includes a buffer layer forming step of forming a buffer layer in a welding region including a diffusion bonded joint of the diffusion bonded structure, the buffer layer having greater ductility than the diffusion bonded joint, and a welding step of bonding the welding region in which the buffer layer is formed to the another part by performing the fusion welding from above the buffer layer.
    Type: Application
    Filed: July 18, 2019
    Publication date: November 7, 2019
    Applicant: IHI CORPORATION
    Inventors: Kunitaka MASAKI, Rie HARADA, Nagisa HOSOYA, Takaaki MATSUOKA, Yutaka MIZO
  • Publication number: 20190071364
    Abstract: A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.
    Type: Application
    Filed: November 6, 2018
    Publication date: March 7, 2019
    Applicant: IHI Corporation
    Inventors: Rie HARADA, Yousuke MIZOKAMI, Takahiko SHINOHARA, Shinji MUTO
  • Patent number: 10118148
    Abstract: An end surface of each first side wall, an end surface of each first middle wall, and an end surface of each first end wall are joined to an adjacent second structure by diffusion bonding, an end surface of each second side wall, an end surface of each second middle wall, and an end surface of each second end wall are joined to an adjacent first structure or a lid structure by diffusion bonding, a thickness of each first side wall is greater than or equal to a thickness of each first middle wall, and a thickness of each second side wall is greater than or equal to a thickness of each second middle wall.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: November 6, 2018
    Assignee: IHI CORPORATION
    Inventors: Shigeki Sakakura, Nobuyuki Honma, Takashi Nishii, Tomohiro Kaneko, Rie Harada, Kunitaka Masaki, Hiroyuki Kamata, Koki Hamada, Akihisa Yano, Tatsuya Oka, Yusuke Takeuchi
  • Publication number: 20180093241
    Abstract: An end surface of each first side wall, an end surface of each first middle wall, and an end surface of each first end wall are joined to an adjacent second structure by diffusion bonding, an end surface of each second side wall, an end surface of each second middle wall, and an end surface of each second end wall are joined to an adjacent first structure or a lid structure by diffusion bonding, a thickness of each first side wall is greater than or equal to a thickness of each first middle wall, and a thickness of each second side wall is greater than or equal to a thickness of each second middle wall.
    Type: Application
    Filed: November 22, 2017
    Publication date: April 5, 2018
    Applicant: IHI CORPORATION
    Inventors: Shigeki SAKAKURA, Nobuyuki HONMA, Takashi NISHII, Tomohiro KANEKO, Rie HARADA, Kunitaka MASAKI, Hiroyuki KAMATA, Koki HAMADA, Akihisa YANO, Tatsuya OKA, Yusuke TAKEUCHI