Abstract: A cell culture method includes performing adherent culture of cells on a coat layer layered on a surface of a cell culture container by placing a culture medium and the cells in the cell culture container. The coat layer includes a layer (i) that includes a layer (i-1) including gelatin or casein and a layer (i-2) that includes a polycationic material and a layer (ii) that is layered on the layer (i) and includes a cell adhesion factor. The layer (ii) is disposed at a position at which the layer (ii) comes into contact with the cells, or the coat layer includes the layer (i) and the layer (i) is disposed at a position at which the layer (i) comes into contact with the cells, and the culture medium includes the cell adhesion factor.

Abstract: A water-based surface treatment agent is used to provide a chemical layer on a copper or copper alloy printing wiring board (PWB). The chemical layer shows excellent heat-resistance and moisture-resistance. The treated PWB maintains excellent solderability for extended lengths of time. The water-based surface treatment agent contains as an active ingredient 2,4-diphenylimidazole, 2,4-diphenyl-5-methylimidazole or 2-phenyl-4-benzyl-5-methylimidazole. The treating compositions with a lower carboxylic acid of up to 4 carbon atoms are soluble in water, and have improved solder wetting properties and improved solder paste spreading property. A copper compound may be included in the aqueous solution to increase the rate at which the chemical layer is formed.

Abstract: An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserves excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredient, a 2-arylimidazole compound represented by the following formula, ##STR1## wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, ##STR2## wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case where R, R1 and R2 are all hydrogen atoms.