Patents by Inventor Rie Wada

Rie Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder alloy, solder material and joined structure
    Patent number: 9764430
    Abstract: Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: September 19, 2017
    Assignee: KOKI Company Limited
    Inventors: Atsushi Irisawa, Rie Wada
  • Lead-Free Solder Alloy, Solder Material and Joined Structure
    Publication number: 20160368104
    Abstract: Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.
    Type: Application
    Filed: February 19, 2015
    Publication date: December 22, 2016
    Inventors: Atsushi Irisawa, Rie Wada
  • SOLDER PASTE
    Publication number: 20120291922
    Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.
    Type: Application
    Filed: December 6, 2010
    Publication date: November 22, 2012
    Applicants: ARAKAWA CHEMICAL INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA, HARIMA CHEMICALS, INC., FUJITSU TEN LIMITED, KOKI COMPANY LIMITED, DENSO CORPORATION
    Inventors: Eiji Iwamura, Kazushi Gotoh, Fumio Ishiga, Takayasu Yoshioka, Masayoshi Utsuno, Atsuo Nakamura, Teruo Okochi, Masaki Sanji, Takuji Sukekawa, Kenshi Ikedo, Yoshiyuki Andoh, Takeshi Shirai, Kimiaki Mori, Rie Wada, Kensuke Nakanishi, Masami Aihara, Seishi Kumamoto
  • FLUX FOR SOLDER PASTE, AND SOLDER PASTE
    Publication number: 20120291921
    Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.
    Type: Application
    Filed: December 6, 2010
    Publication date: November 22, 2012
    Applicants: ARAKAWA CHEMICAL INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA, HARIMA CHEMICALS, INC., FUJITSU TEN LIMITED, KOKI COMPANY LIMITED, DENSO CORPORATION
    Inventors: Eiji Iwamura, Kazushi Gotoh, Shinsuke Nagasaka, Takayasu Yoshioka, Masayoshi Utsuno, Atsuo Nakamura, Teruo Okochi, Masaki Sanji, Takuji Sukekawa, Kenshi Ikedo, Yoshiyuki Andoh, Takeshi Shirai, Kimiaki Mori, Rie Wada, Kensuke Nakanishi, Masami Aihara, Seishi Kumamoto