Patents by Inventor Rieko Chujo

Rieko Chujo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing surface acoustic wave device and surface acoustic wave device
    Patent number: 6731045
    Abstract: An attempt is made to reduce the size of a multichip package obtained by mounting a plurality of surface acoustic wave elements having different frequency characteristics in one package. For this purpose, when a plurality of surface acoustic wave elements are face-down bonded to a package, the ultrasound wave application direction is set to a direction substantially perpendicular to the direction in which the surface acoustic wave elements are juxtaposed.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: May 4, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Rieko Chujo
  • Surface acoustic wave apparatus and method of manufacturing the same
    Patent number: 6404100
    Abstract: A surface acoustic wave apparatus includes a package having a concave-shaped base and a concave-shaped cap and a surface acoustic wave element housed in the package. The base has a mounting surface on which the surface acoustic wave element is mounted and a side wall raised from the periphery of the mounting surface. The side wall of the base is formed lower than the highest part of the surface acoustic wave element mounted on the mounting surface. Since the surface acoustic wave element mounted on the base is raised above the side wall of the base, the surface acoustic wave element is subjected easily to, for example, test, measurement, fault analysis, and others.
    Type: Grant
    Filed: October 18, 1999
    Date of Patent: June 11, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Rieko Chujo, Masayoshi Koshino, Kaoru Sakinada
  • Method of manufacturing surface acoustic wave device and surface acoustic wave device
    Publication number: 20020057037
    Abstract: An attempt is made to reduce the size of a multichip package obtained by mounting a plurality of surface acoustic wave elements having different frequency characteristics in one package. For this purpose, when a plurality of surface acoustic wave elements are face-down bonded to a package, the ultrasound wave application direction is set to a direction substantially perpendicular to the direction in which the surface acoustic wave elements are juxtaposed.
    Type: Application
    Filed: January 11, 2002
    Publication date: May 16, 2002
    Inventor: Rieko Chujo