Patents by Inventor Rieko Muraoka

Rieko Muraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for removing organic films
    Patent number: 6851873
    Abstract: A method and an apparatus for removing an organic film, such as a resist film, from a substrate surface are provided wherein a treatment liquid containing dissolved ozone, and preferably formed from liquid ethylene or propylene carbonate, or both, is contacted with the substrate having the organic film, and the organic film removed, wherein the apparatus contains (A) a treatment liquid delivery device, (B) a film contact device, (C) a liquid circulation device and (D) an ozone dissolution device.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: February 8, 2005
    Assignees: Nomura Micro Science Co., Ltd., UMS Co., Ltd.
    Inventors: Hisashi Muraoka, Rieko Muraoka, Asuka Sato, Mitsuru Endo
  • Method and apparatus for removing organic films
    Publication number: 20040076912
    Abstract: A method and an apparatus for removing an organic film such as a resist film from a substrate surface are provided. These are very safe even at high temperatures, and use a treatment liquid which can be recycled and reused. A treatment liquid typically formed from liquid ethylene carbonate, propylene carbonate, or a liquid mixture of these two compounds, and in particular such a treatment liquid containing dissolved ozone, is contacted with a substrate with an organic film, and the organic film is removed.
    Type: Application
    Filed: October 14, 2003
    Publication date: April 22, 2004
    Inventors: Hisashi Muraoka, Rieko Muraoka, Asuka Sato, Mitsuru Endo
  • Method and apparatus for removing organic films
    Patent number: 6696228
    Abstract: A method and an apparatus for removing an organic film such as a resist film from a substrate surface are provided. These are very safe even at high temperatures, and use a treatment liquid which can be recycled and reused. A treatment liquid typically formed from liquid ethylene carbonate, propylene carbonate, or a liquid mixture of these two compounds, and in particular such a treatment liquid containing dissolved ozone, is contacted with a substrate with an organic film, and the organic film is removed.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: February 24, 2004
    Assignees: UMS Co., Ltd., Nomura Micro Science Co., Ltd.
    Inventors: Hisashi Muraoka, Rieko Muraoka, Asuka Sato, Mitsuru Endo
  • Method and apparatus for removing organic films
    Publication number: 20030108823
    Abstract: A method and an apparatus for removing an organic film such as a resist film from a substrate surface are provided. These are very safe even at high temperatures, and use a treatment liquid which can be recycled and reused. A treatment liquid typically formed from liquid ethylene carbonate, propylene carbonate, or a liquid mixture of these two compounds, and in particular such a treatment liquid containing dissolved ozone, is contacted with a substrate with an organic film, and the organic film is removed.
    Type: Application
    Filed: October 21, 2002
    Publication date: June 12, 2003
    Applicants: UMS Co., Ltd., Purex Co., Ltd.
    Inventors: Hisashi Muraoka, Rieko Muraoka, Asuka Sato, Mitsuru Endo