Patents by Inventor Riguang Zhang

Riguang Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED light source packaging method, LED light source package structure and light source module
    Patent number: 9379292
    Abstract: A method for packaging LED light source, a package structure of LED light source and a light source module are provided. The method for packaging LED light source includes providing a substrate integrated with LED chips, where a surface of the substrate is provided with a filling layer configured to cover the LED chips; printing, on the a surface of the filling layer, phosphor patterns to cover the surface of the filling layer, where the phosphor patterns include one or more first phosphor patterns, one or more second phosphor patterns and one or more third phosphor patterns, where every two of the first, the second and the third phosphor patterns are adjacent to each other. The package structure of LED light source and the light source module have good uniformity of light-emission and low cost, and the process of the method for packaging LED light source is simple.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: June 28, 2016
    Assignee: Ningbo Sunpu Led Co., Ltd.
    Inventors: Riguang Zhang, Sheng Lin, Yaohua Zhang, Yuanbao Du
  • LED LIGHT SOURCE PACKAGING METHOD, LED LIGHT SOURCE PACKAGE STRUCTURE AND LIGHT SOURCE MODULE
    Publication number: 20150349211
    Abstract: A method for packaging LED light source, a package structure of LED light source and a light source module are provided. The method for packaging LED light source includes providing a substrate integrated with LED chips, where a surface of the substrate is provided with a filling layer configured to cover the LED chips; printing, on the a surface of the filling layer, phosphor patterns to cover the surface of the filling layer, where the phosphor patterns include one or more first phosphor patterns, one or more second phosphor patterns and one or more third phosphor patterns, where every two of the first, the second and the third phosphor patterns are adjacent to each other. The package structure of LED light source and the light source module have good uniformity of light-emission and low cost, and the process of the method for packaging LED light source is simple.
    Type: Application
    Filed: December 5, 2014
    Publication date: December 3, 2015
    Applicant: NINGBO SUNPU OPTO SEMICONDUCTOR CO., LTD.
    Inventors: Riguang Zhang, Sheng Lin, Yaohua Zhang, Yuanbao Du