Patents by Inventor Rih-You CHEN

Rih-You CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10802217
    Abstract: An optical waveguide structure and a manufacturing method thereof are provided. The optical waveguide structure includes: a substrate; a first-type semiconductor conductive layer disposed on the substrate; a first confining layer disposed on the first-type semiconductor conductive layer; a waveguide layer disposed on the first confining layer and including a luminescent material; a polymer filling layer disposed on the first confining layer and adjacent to the waveguide layer, wherein the viscosity of the polymer filling layer is less than 52 mm2/s; a second confining layer disposed on the waveguide layer and the polymer filling layer; a cladding layer disposed on the second confining layer; and a second-type semiconductor conductive layer disposed on the cladding layer.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: October 13, 2020
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Jia-Ren Zou, Yi-Jen Chiu, Rih-You Chen, Cong-Long Chen
  • Publication number: 20200284982
    Abstract: An optical waveguide structure and a manufacturing method thereof are provided. The optical waveguide structure includes: a substrate; a first-type semiconductor conductive layer disposed on the substrate; a first confining layer disposed on the first-type semiconductor conductive layer; a waveguide layer disposed on the first confining layer and including a luminescent material; a polymer filling layer disposed on the first confining layer and adjacent to the waveguide layer, wherein the viscosity of the polymer filling layer is less than 52 mm2/s; a second confining layer disposed on the waveguide layer and the polymer filling layer; a cladding layer disposed on the second confining layer; and a second-type semiconductor conductive layer disposed on the cladding layer.
    Type: Application
    Filed: May 3, 2019
    Publication date: September 10, 2020
    Inventors: Jia-Ren ZOU, Yi-Jen CHIU, Rih-You CHEN, Cong-Long CHEN