Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1): wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.

Abstract: A resin composition contains a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.; and a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less.

Abstract: A resin composition contains a maleimide compound (A) having an indane structure in the molecule, and a styrenic polymer being solid at 25° C.

Abstract: A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.

Abstract: A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1), where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R1 to R3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond.

Abstract: A resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphine oxide compound (B) has a structure expressed by the following formula (b0), where X is a monovalent or divalent hydrocarbon group having at least one aromatic ring or an alkylene group and n is either 1 or 2.

Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan? = E?/E?) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E?) of the cured product of the resin composition to a storage modulus (E?) thereof. The loss modulus (E?), the storage modulus (E?), and the loss tangent (tan? = E?/E?) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9?X2/X1?1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.

Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9?X2/X1?1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.

Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).

Abstract: A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.

Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.