Abstract: Provided are an apparatus for and a method of removing foreign materials from a substrate which reliably remove the foreign materials, eliminate a chance of redeposition of the foreign materials, and are applicable even to large-size substrates. The apparatus for removing foreign materials includes electrostatic chucks (2, 3) forming a substrate chucking surface (4) to which the substrate (1) is attracted; a resin sheet supplying means (9) for supplying a resin sheet (5) to the substrate chucking surface (4); resin sheet collecting means (13) for collecting the supplied resin sheet (5); and a substrate transfer means for transferring the substrate (1). The substrate (1) supplied to the electrostatic chucks (2, 3) by the substrate transfer means is attracted to the substrate chucking surface (4) through the resin sheet (5), and a foreign material (22) deposited on a side of the substrate chucking surface (4) of the substrate (1) is transferred onto the resin sheet (5) and removed.

Abstract: An electrostatic chuck having excellent chucking force and holding force is provided. The electrostatic chuck includes a laminate structure in which a first insulating layer, a first electrode layer, an interelectrode insulating layer, a second electrode layer and a second insulating layer are successively laminated on a metal base in an order of increasing distance from the metal base. The second electrode layer includes a pattern electrode having a plurality of opening portions within a flat area, and a shortest distance X between mutually opening portions and a length L of a line segment formed by feet of perpendiculars when barycenters of the adjacent opening portions are projected to a virtual line which is a straight line parallel to the shortest distance X satisfy L/X?1.5 and L<2.6 mm.

Abstract: Provided are an apparatus for and a method of removing foreign materials from a substrate which reliably remove the foreign materials, eliminate a chance of redeposition of the foreign materials, and are applicable even to large-size substrates. The apparatus for removing foreign materials includes electrostatic chucks (2, 3) forming a substrate chucking surface (4) to which the substrate (1) is attracted; a resin sheet supplying means (9) for supplying a resin sheet (5) to the substrate chucking surface (4); resin sheet collecting means (13) for collecting the supplied resin sheet (5); and a substrate transfer means for transferring the substrate (1). The substrate (1) supplied to the electrostatic chucks (2, 3) by the substrate transfer means is attracted to the substrate chucking surface (4) through the resin sheet (5), and a foreign material (22) deposited on a side of the substrate chucking surface (4) of the substrate (1) is transferred onto the resin sheet (5) and removed.

Abstract: An electrostatic chuck having excellent chucking force and holding force is provided. The electrostatic chuck includes a laminate structure in which a first insulating layer, a first electrode layer, an interelectrode insulating layer, a second electrode layer and a second insulating layer are successively laminated on a metal base in an order of increasing distance from the metal base. The second electrode layer includes a pattern electrode having a plurality of opening portions within a flat area, and a shortest distance X between mutually opening portions and a length L of a line segment formed by feet of perpendiculars when barycenters of the adjacent opening portions are projected to a virtual line which is a straight line parallel to the shortest distance X satisfy L/X?1.5 and L<2.6 mm.

Abstract: A method for vacuum drying of a substrate which can eliminate not only the moisture adhered to the substrate surface but also the moisture impregnated inside of the films which form the devices in a shot time without deforming nor deteriorating the devices formed on the substrate in the drying. The method for vacuum drying of a substrate, concerning a method for drying a substrate by processing the substrate surface in a desired condition, cleaning the processed substrate with cleaning liquid, and drying the cleaned substrate, comprises the steps of heating the substrate surface to a predetermined temperature to vaporize the moisture of the surface as vapor and thereby detach the moisture from the substrate to outside, and vacuuming the detached vapor at a predetermined vacuum pressure to eliminate the moisture from the wafer.

Abstract: A method for cleaning a substrate with sherbet-like composition, comprising mixing the liquid organic agent and pure water in a mixing vessel to form a mixture, supercooling the mixture uniformly at a predetermined temperature while stirring the mixture, wherein the stirring includes creating vortices in the mixture, growing the vortices and diffusing the grown vortices in the mixture, thus providing sherbet-like cleaning composition and moving the sherbet-like cleaning composition relative to the substrate to be cleaned.

Abstract: A method for vacuum drying of a substrate which can eliminate not only the moisture adhered to the substrate surface but also the moisture impregnated inside of the films which form the devices in a shot time without deforming nor deteriorating the devices formed on the substrate in the drying. The method for vacuum drying of a substrate, concerning a method for drying a substrate by processing the substrate surface in a desired condition, cleaning the processed substrate with cleaning liquid, and drying the cleaned substrate, comprises the steps of heating the substrate surface to a predetermined temperature to vaporize the moisture of the surface as vapor and thereby detach the moisture from the substrate to outside, and vacuuming the detached vapor at a predetermined vacuum pressure to eliminate the moisture from the wafer.

Abstract: A system for cleaning a substrate according to the present invention comprises an apparatus for producing a sherbet-like composition consisting of snow ice grains and a chemical agent, holder means for holding a substrate to be cleaned, supply means for supplying to the substrate the sherbet-like composition for cleaning the substrate, and means for moving the sherbet-like composition being supplied relative to at least one of the surfaces of the substrate.

Abstract: The apparatus for cleaning a substrate comprises cleaning chambers each of which is disposed on a respective side with reference to a clearance therebetween. The apparatus further comprises a plurality of chucks which clamp the substrate to be cleaned and move the substrate between the inside the clearance between the cleaning chambers and the outside thereof, a pair of screws each of which is disposed to be rotatable and close to a respective surface of the substrate when the substrate is introduced into the clearance between the cleaning chambers, liquid supplying nozzles which supply the screws with pure water or mixed liquid including pure water and medicinal liquid, and snow ice supplying nozzles which supply the screws with snow ice having a predetermined granular diameter. The opposite surfaces of the substrate are cleaned by rotating pure water or mixed liquid including pure water and medicinal liquid by means of the screws to press it against the opposite surfaces of the substrate.