Patents by Inventor Rika OYA

Rika OYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal conducting sheet and method for producing same
    Patent number: 10118367
    Abstract: A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: November 6, 2018
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Rika Oya
  • THERMAL CONDUCTING SHEET AND METHOD FOR PRODUCING SAME
    Publication number: 20170291391
    Abstract: A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.
    Type: Application
    Filed: March 28, 2017
    Publication date: October 12, 2017
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Rika OYA