Patents by Inventor Rika Sasaki

Rika Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7259347
    Abstract: A change in machining volume is calculated using a shape of the electrode and a shape of the workpiece expressed by three-dimensional models and machining condition data and the machining time is calculated according to actual machining status based on the calculated change in machining volume.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: August 21, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Rika Sasaki, Tomoko Sendai, Hidetaka Katougi
  • Publication number: 20060065638
    Abstract: A change in machining volume is calculated using a shape of the electrode and a shape of the workpiece expressed by three-dimensional models and machining condition data and the machining time is calculated according to actual machining status based on the calculated change in machining volume.
    Type: Application
    Filed: May 20, 2003
    Publication date: March 30, 2006
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Rika Sasaki, Tomoko Sendai, Hidetaka Katougi
  • Patent number: 6790293
    Abstract: There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunction of circuit that may be caused to generate by voltage noises that tend to be generated by the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, −40° C. to +85° C.), or that may be caused to generate by voltage noises to be generated by the fluctuation of parasitic capacity between circuits which may be caused to generate due to a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, acrylic resin for preventing the generation of voltage noises in electronic devices.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: September 14, 2004
    Assignees: NEC Corporation, Tamurakaken Corporation
    Inventors: Masahiro Nomura, Toshiyuki Oga, Takanobu Gido, Takao Ono, Yoshiyuki Takahashi, Rika Sasaki
  • Publication number: 20020195170
    Abstract: There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunction of circuit that may be caused to generate by voltage noises that tend to be generated by the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, −40° C. to +85° C.), or that may be caused to generate by voltage noises to be generated by the fluctuation of parasitic capacity between circuits which may be caused to generate due to a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, acrylic resin for preventing the generation of voltage noises in electronic devices.
    Type: Application
    Filed: May 13, 2002
    Publication date: December 26, 2002
    Inventors: Masahiro Nomura, Toshiyuki Oga, Takanobu Gido, Takao Ono, Yoshiyuki Takahashi, Rika Sasaki
  • Patent number: D656120
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: March 20, 2012
    Assignee: JVC Kenwood Corporation
    Inventor: Rika Sasaki