Patents by Inventor Riki SHIMABUKURO
Riki SHIMABUKURO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11145799Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: July 14, 2020Date of Patent: October 12, 2021Assignee: ROHM CO., LTD.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Patent number: 10957676Abstract: A light emitting device (LED) package includes: a substrate having a loading surface, a mounting surface and a pair of concave portions formed at both ends of the substrate, wherein each of the concave portions has an inner surface intersecting both of the loading surface and the mounting surface; metal wirings including a pair of electrodes, which covers a portion of the loading surface and the mounting surface and the inner surface, and a conductive part disposed on the loading surface; an LED chip loaded on the conductive part; a housing having a side wall surrounding the LED chip and a supporting surface facing the loading surface; and a covering member which is disposed on the loading surface and has a closing portion overlapping at least a portion of the concave portions when viewed from above, wherein at least a portion of the supporting surface is fixed to the closing portion.Type: GrantFiled: March 17, 2016Date of Patent: March 23, 2021Assignee: ROHM CO., LTD.Inventors: Masahiko Kobayakawa, Riki Shimabukuro
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Publication number: 20200343428Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: July 14, 2020Publication date: October 29, 2020Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 10756247Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: July 12, 2018Date of Patent: August 25, 2020Assignee: Rohm Co., LTD.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Patent number: 10439117Abstract: An optical device includes a substrate, a conductive layer formed over the substrate, an insulating layer formed over the conductive layer, a first optical element disposed over the conductive layer, and a sealing resin part configured to cover the first optical element. The conductive layer includes a first conductive section, a second conductive section spaced apart from the first conductive section, and a first conductive portion extending in a first direction from the first conductive section. The first conductive portion is spaced apart from the second conductive section in a second direction intersecting with the first direction, and the insulating layer includes a first insulating part formed over the first conductive portion, and the first insulating part includes a portion overlapping with the second conductive section in the first direction.Type: GrantFiled: June 7, 2018Date of Patent: October 8, 2019Assignee: Rohm Co., Ltd.Inventor: Riki Shimabukuro
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Patent number: 10193040Abstract: An LED package includes a substrate having a substrate main surface and a substrate back surface, which face opposite sides in a thickness direction, a main surface electrode which is disposed on the substrate main surface and includes a first pad and a first die pad separated from each other, a first LED chip which is mounted on the first die pad and has an electrode pad formed on a first chip main surface facing the same direction as the substrate main surface, and a first wire connecting the first pad and the electrode pad. The first pad has a first base portion and a first pad portion having one end connected to the first base portion. The first pad portion of the first pad extends from the first base portion toward the first die pad obliquely.Type: GrantFiled: October 30, 2017Date of Patent: January 29, 2019Assignee: Rohm Co., Ltd.Inventor: Riki Shimabukuro
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Publication number: 20180358524Abstract: An optical device includes a substrate, a conductive layer formed over the substrate, an insulating layer formed over the conductive layer, a first optical element disposed over the conductive layer, and a sealing resin part configured to cover the first optical element. The conductive layer includes a first conductive section, a second conductive section spaced apart from the first conductive section, and a first conductive portion extending in a first direction from the first conductive section. The first conductive portion is spaced apart from the second conductive section in a second direction intersecting with the first direction, and the insulating layer includes a first insulating part formed over the first conductive portion, and the first insulating part includes a portion overlapping with the second conductive section in the first direction.Type: ApplicationFiled: June 7, 2018Publication date: December 13, 2018Inventor: Riki SHIMABUKURO
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Publication number: 20180331266Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: July 12, 2018Publication date: November 15, 2018Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 10038130Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: December 6, 2016Date of Patent: July 31, 2018Assignee: Rohm Co., Ltd.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20180182945Abstract: An LED package includes a substrate having a substrate main surface and a substrate back surface, which face opposite sides in a thickness direction, a main surface electrode which is disposed on the substrate main surface and includes a first pad and a first die pad separated from each other, a first LED chip which is mounted on the first die pad and has an electrode pad formed on a first chip main surface facing the same direction as the substrate main surface, and a first wire connecting the first pad and the electrode pad. The first pad has a first base portion and a first pad portion having one end connected to the first base portion. The first pad portion of the first pad extends from the first base portion toward the first die pad obliquely.Type: ApplicationFiled: October 30, 2017Publication date: June 28, 2018Inventor: Riki SHIMABUKURO
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Publication number: 20170084811Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: December 6, 2016Publication date: March 23, 2017Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 9548287Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: December 1, 2014Date of Patent: January 17, 2017Assignee: Rohm Co., Ltd.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20160284678Abstract: An LED package includes: a substrate having a loading surface, a mounting surface and a pair of concave portions formed at both ends of the substrate, wherein each of the concave portions has an inner surface intersecting both of the loading surface and the mounting surface; metal wirings including a pair of electrodes, which covers a portion of the loading surface and the mounting surface and the inner surface, and a conductive part disposed on the loading surface; an LED chip loaded on the conductive part; a housing having a side wall surrounding the LED chip and a supporting surface facing the loading surface; and a covering member which is disposed on the loading surface and has a closing portion overlapping at least a portion of the concave portions when viewed from above, wherein at least a portion of the supporting surface is fixed to the closing portion.Type: ApplicationFiled: March 17, 2016Publication date: September 29, 2016Inventors: Masahiko KOBAYAKAWA, Riki SHIMABUKURO
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Publication number: 20150129908Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: December 1, 2014Publication date: May 14, 2015Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO
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Patent number: 8901578Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: GrantFiled: May 10, 2012Date of Patent: December 2, 2014Assignee: Rohm Co., Ltd.Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
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Publication number: 20120286301Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.Type: ApplicationFiled: May 10, 2012Publication date: November 15, 2012Applicant: ROHM CO., LTD.Inventors: Masahiko KOBAYAKAWA, Shinji ISOKAWA, Riki SHIMABUKURO