Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.

Abstract: The purpose of the present invention is to provide an electroconductive adhesive composition that does not readily peel from an adherend material even when subjected to repeated temperature changes, and that furthermore has excellent thermal conductivity. The present invention relates to an electroconductive adhesive composition containing an organic acid (A) having an acid dissociation constant pKa of 4.8 or lower and an electroconductive filler (B), the electroconductive adhesive composition containing 0.01-0.2% by mass of the organic acid (A) and at least 85% by mass of the electroconductive filler (B) with respect to the entire quantity of the electroconductive adhesive composition.

Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.

Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.

Abstract: The present invention provides an electrically conductive bonding material having a high bonding strength and a high thermal conductivity, and capable of forming a bonding layer providing a very low porosity under low pressurization. The present invention relates to an electrically conductive bonding material which bonds a chip and an adherend under pressure, the electrically conductive bonding material containing silver particles; silver compound particles; and a dispersant, wherein the silver particles and the silver compound particles are present in a weight ratio of 30:70 to 70:30, and the electrically conductive bonding material provide a porosity of 15% or less after the chip and the adherend are subject to pressurizing-bond under an air atmosphere of pressure of 10 MPa and 280° C. for 5 minutes.

Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.

Abstract: [Problem] Provided is a photocurable electroconductive ink composition for screen printing which can provide printability, printing precision and adhesiveness on a substrate good enough for screen printing, and can show stable electroconductive properties. [Solution] A photocurable electroconductive ink composition for screen printing, comprising: (A) an electroconductive filler, (B) a photopolymerizable resin precursor consisting of an oligomer of urethane acrylate, monofunctional acrylate and polyfunctional acrylate, (C) an alkyd resin, (D) two or more photopolymerization initiators and (E) a polymer dispersant, in which the content of the electroconductive filler (A) is 70 to 90 mass % relative to the total mass of the photocurable electroconductive ink composition, and more than 50 mass % of the electroconductive filler is silver powder in a scale-like, foil-like or flake-like form having a particle diameter at 50 % particle size distribution of 0.3 to 3.

Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.

Abstract: The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 ?m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the component (A), (B), (C), and (D) is within a specific range.

Abstract: Disclosed is a photocurable electroconductive ink composition including: (A) an oligomer of urethane acrylates, (B) three types of acrylates composed of either tetrafunctional acrylates or trifunctional acrylates, difunctional acrylates and monofunctional acrylates, (C) an electroconductive filler, (D) two or more types of photopolymerization initiators and (E) a polymeric dispersing agent, wherein the amount of the electroconductive filler (C) to be mixed is from 77 to 85% by mass based on the total mass of the photocurable electroconductive ink composition, and 80% by mass or more of the electroconductive filler (C) is a scaly, foil-like or flakey silver powder having a particle size corresponding to a particle size distribution at 50% of more than 5 ?m.

Abstract: [Problem] Provided is a photocurable electroconductive ink composition for screen printing which can provide printability, printing precision and adhesiveness on a substrate good enough for screen printing, and can show stable electroconductive properties. [Solution] A photocurable electroconductive ink composition for screen printing, comprising: (A) an electroconductive filler, (B) a photopolymerizable resin precursor consisting of an oligomer of urethane acrylate, monofunctional acrylate and polyfunctional acrylate, (C) an alkyd resin, (D) two or more photopolymerization initiators and (E) a polymer dispersant, in which the content of the electroconductive filler (A) is 70 to 90 mass % relative to the total mass of the photocurable electroconductive ink composition, and more than 50 mass % of the electroconductive filler is silver powder in a scale-like, foil-like or flake-like form having a particle diameter at 50 % particle size distribution of 0.3 to 3.

Abstract: The invention relates to a thermally conductive, electrically conductive adhesive composition including: (A) an electrically conductive filler, (B) an epoxy resin, and (C) a curing agent. The electrically conductive filler (A) is a submicron fine silver powder, and the content of the fine silver powder is 75 to 94% by mass of the total amount of the adhesive composition. The content of the epoxy resin (B) is 5 to 20% by mass of the total amount of the adhesive composition. The curing agent (C) is a compound of Formula (I), (II), or (III), as defined herein, and the content of the compound is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).

Abstract: Disclosed is a photocurable electroconductive ink composition including: (A) an oligomer of urethane acrylates, (B) three types of acrylates composed of either tetrafunctional acrylates or trifunctional acrylates, difunctional acrylates and monofunctional acrylates, (C) an electroconductive filler, (D) two or more types of photopolymerization initiators and (E) a polymeric dispersing agent, wherein the amount of the electroconductive filler (C) to be mixed is from 77 to 85% by mass based on the total mass of the photocurable electroconductive ink composition, and 80% by mass or more of the electroconductive filler (C) is a scaly, foil-like or flakey silver powder having a particle size corresponding to a particle size distribution at 50% of more than 5 ?m.