Patents by Inventor Rikio Hara

Rikio Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4780358
    Abstract: A polyamide adhesive composition comprising 100 parts by weight of a polymer component and 0.1 to 5 parts by weight of an aminosilane compound. The polymer component comprises 50 to 99.5% by weight of a polyamide and 0.5 to 50% by weight of a modified polyolefin formed by grafting a polyolefin with an unsaturated compound having a polar group in the molecule and/or a polymer other than polyamides, having a polar group or an aromatic group and a tensile modulus not higher than 2,000 kg/cm.sup.2.
    Type: Grant
    Filed: September 8, 1986
    Date of Patent: October 25, 1988
    Assignee: Ube Industries, Ltd.
    Inventors: Bunsaku Ito, Kimio Fukuda, Rikio Hara
  • Patent number: 4690856
    Abstract: A polyamide adhesive composition comprising 100 parts by weight of a polymer component and 0.1 to 5 parts by weight of an aminosilane compound. The polymer component comprises 50 to 99.5% by weight of a polyamide and 0.5 to 50% by weight of a modified polyolefin formed by grafting a polyolefin with an unsaturated compound having a polar group in the molecule and/or a polymer other than polyamides, having a polar group or an aromatic group and a tensile modulus not higher than 2,000 kg/cm.sup.2. A laminate comprising a metal material laminated on at least one surface of an adhesive layer composed of the polyamide adhesive composition exhibits high gasoline resistance, high heat resistance, and high T-peel strength.
    Type: Grant
    Filed: December 26, 1985
    Date of Patent: September 1, 1987
    Assignee: Ube Industries, Inc.
    Inventors: Bunsaku Ito, Kimio Fukuda, Rikio Hara