Patents by Inventor Rikito KANAZAWA

Rikito KANAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230276629
    Abstract: A semiconductor device includes a body including conductive layers stacked and spaced from each other in a first direction and first and second areas along a second direction intersecting the first direction, an insulating portion extending along the directions in the areas and dividing the conductive layers in a third direction intersecting the directions, first columnar portions extending along the first direction in the first area and including a semiconductor layer, memory cells being formed at intersections between the conductive and semiconductor layers, second columnar portions extending along the first direction in the second area and including an insulator, third columnar portions extending along the first direction in the second area and including a semiconductor layer, and contacts extending along the first direction in the second area and connected to a conductive layer. The second portions are arranged along the insulating portion on both sides thereof in the third direction.
    Type: Application
    Filed: September 1, 2022
    Publication date: August 31, 2023
    Inventors: Rikito KANAZAWA, Masaki TSUJI, Kojiro SHIMIZU