Patents by Inventor Rikiya Kamimura
Rikiya Kamimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190229103Abstract: A semiconductor device includes: a first switching element that is provided on a high side; a first diode element that is connected in parallel to the first switching element; a second switching element that is provide on a low side and connected in series to the first switching element; and a second diode element that is connected in parallel to the second switching element, wherein the first switching element and one of the first diode element and the second diode element are stacked adjacently to each other in a vertical direction of respective electrode surfaces thereof via a conductive electrode, the second switching element and the other of the first diode element and the second diode element that is different from the diode element adjacent to the first switching element are stacked adjacently to each other in a vertical direction of respective electrode surfaces thereof via a conductive electrode, and the first switching element and the second switching element are not adjacent in a vertical directionType: ApplicationFiled: January 25, 2019Publication date: July 25, 2019Applicants: WASEDA UNIVERSITY, MITSUI HIGH-TEC., INC., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kohei TATSUMI, Kazuhito KAMEI, Rikiya Kamimura, Koji SHIMIZU, Kazutoshi UEDA, Nobuaki SATO, Keiji TODA, Masayuki HIKITA, Akihiro IMAKIIRE
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Publication number: 20110042812Abstract: An electronic device includes a power element on a first substrate and an electronic component on a second substrate. The first and second substrates are stacked so that the power element and the electronic component can be located between the first and second substrates. A first end of a first wire is connected to the power element. A second end of the first wire is connected to the first substrate. A middle portion of the first wire projects toward the second substrate. A first end of a second wire is connected to the power element. A second end of the wire extends above a top of the middle portion of the first conductive member and is connected to the second substrate.Type: ApplicationFiled: July 29, 2010Publication date: February 24, 2011Applicant: DENSO CORPORATIONInventors: Kimiharu Kayukawa, Rikiya Kamimura, Masaya Mizutani
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Patent number: 7417318Abstract: A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750° C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.Type: GrantFiled: April 26, 2004Date of Patent: August 26, 2008Assignee: Denso CorporationInventors: Tohru Nomura, Yoshihiro Shimoide, Yoshihiko Shiraishi, Rikiya Kamimura, Hiroshi Kasugai
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Patent number: 7107661Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.Type: GrantFiled: December 16, 2002Date of Patent: September 19, 2006Assignee: Denso CorporationInventors: Rikiya Kamimura, Katsumi Nakamura, Kouji Kond, Atsusi Sakaida, Toshihisa Taniguchi
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Publication number: 20050246879Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.Type: ApplicationFiled: July 21, 2005Publication date: November 10, 2005Inventors: Rikiya Kamimura, Katsumi Nakamura, Kouji Kondo, Atsusi Sakaida, Toshihisa Taniguchi
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Publication number: 20040212085Abstract: A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750° C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.Type: ApplicationFiled: April 26, 2004Publication date: October 28, 2004Applicant: DENSO CORPORATIONInventors: Tohru Nomura, Yoshihiro Shimoide, Yoshihiko Shiraishi, Rikiya Kamimura, Hiroshi Kasugai
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Publication number: 20040111854Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.Type: ApplicationFiled: March 26, 2003Publication date: June 17, 2004Inventors: Rikiya Kamimura, Katsumi Nakamura, Kouji Kondo, Atsusi Sakaida, Toshihisa Taniguchi
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Patent number: 6360600Abstract: Drive electrodes and sensing electrodes are formed on a front face of a piezoelectric body of a vibrator. A first reference electrode is formed on a rear face. Second reference electrodes are formed on side faces of arm bars of the vibrator at a position corresponding to the sensing electrodes. The second reference electrodes are connected to the first reference electrode formed on said rear face.Type: GrantFiled: September 9, 1999Date of Patent: March 26, 2002Assignee: Denso CorporationInventors: Hisao Kuroki, Rikiya Kamimura
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Patent number: 5209688Abstract: A plasma display panel is disclosed, which comprises a pair of insulating substrates with a predetermined space therebetween; a group of anode electrodes and a group of cathode electrodes formed on the inner side of each of the insulating substrates in such a manner that the groups of the electrodes are normal to each other; and barriers formed on the insulating substrate having the anode electrodes thereon by photolithography. Since the barriers are formed by photolithography using an ultraviolet-curable resin or positive-type resist, high precison patterns having a line width of 100 .mu.m or less and a line spacing of 100 .mu.m or less can be easily obtained and, thereby, a high resolution plasma display having a decreased picture element area and a wider discharge space can be obtained. When photolithography is used in the formation of the cathode electrodes, further high precision fine patterns can be obtained and further finely detailed pitch of picture elements can be achieved.Type: GrantFiled: March 20, 1991Date of Patent: May 11, 1993Assignee: Narumi China CorporationInventors: Susumu Nishigaki, Syozo Ohtomo, Rikiya Kamimura, Kazunari Tanaka