Abstract: A fusible plug employs an alloy which comprises 5-8 mass % of Sn, 31-34 mass % of Bi, 0.2-4 mass % of Sb, and a remainder of In. The alloy melts at approximately 66-70° C. The alloy may further contain at most 2.0 mass % of at least one element selected from strengthening elements consisting of 0.1-1.0 mass % of Cu, 0.1-1.0 mass % of Ge, 0.1-0.7 mass % of Ag, 0.1-0.6 mass % of Au, 0.2-0.6 mass % of Zn, 0.002-0.1 mass % of Ni, and 0.01-0.1 mass % of a lanthanoid.

Abstract: Problem A conventional alloy for a fusible plug contained harmful elements such as Cd or Pb, so there was a concern of pollution by these harmful elements. The present invention provides a fusible plug which does not contain the harmful components Cd or Pb, with which the alloy is not forced out of the fusible plug even when used for long periods as a safety device for refrigeration equipment, and which has a high mechanical strength such as creep strength. Means for Solving the Problem A fusible plug is used which employs a fusible alloy consisting essentially of 0.1-2.0 mass percent of Sn, 31-37 mass percent of Bi, and a remainder of In, the alloy melting at approximately at 70-75° C. A fusible plug is used which employs an alloy consisting essentially of 0.05-0.4 mass percent of Zn, 47-55 mass percent of Bi, and a remainder of In, the alloy melting at approximately 90-95° C.

Abstract: High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used. A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface.

Abstract: A sprinkler head adapted for a specific yield temperature. The sprinkler head uses a heat-sensitive material composed of Sn in an amount of 0.1-2.0% by mass, Bi in an amount of 31-37% by mass and In for balance for a temperature range around 70-75° C. or a heat-sensitive material composed of Zn in an amount of 0.05-0.4% by mass, Bi in an amount of 43-55% by mass and In for balance for a temperature range around 90-95° C.

Abstract: A waterproof cover has a first cover portion made of a waterproof material for removable connection to and covering a part of a device that has a recording portion for performing recording on a recording medium that is dischargeable from the device. A second cover portion is made of a flexible waterproof material for covering the device and for removable connection to the first cover portion to form an opening portion through which the recording medium passes when discharged from the device. Connecting members removably connect the second cover portion to the first cover portion. Positioning members position the second cover portion relative to the first cover portion prior to connection of the second cover portion to the first cover portion by the connecting member.

Abstract: As a replacement for high-temperature solder having a solidus temperature of at least 250° C. for bonding a package and a lid of a functional part, a solder paste formed by mixing a Cu-based metal powder with a solidus temperature of at least 400° C. and an Sn-based solder powder is applied to a lid of a difficult to solder material which was previously subjected to plating having good solderability and heated to obtain a solder layer comprising the Cu-based metal powder, Cu6Sn5 intermetallic compounds, and lead-free solder on the plated surface. The intermetallic compounds are bonded to the difficult to solder material and the intermetallic compounds are connected to each other, so the solder layer functions as a high-temperature solder. The problem of poor solderability of high-temperature solders is avoided by the present invention.

Abstract: High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used. A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface.

Abstract: Problems: A conventional alloy for a fusible plug contained harmful elements such as Cd and Pb, and there was a concern of pollution by these harmful elements. The present invention provides a fusible plug which does not contain the harmful elements Cd and Pb, with which the alloy is not forced out of the fusible plug even when used for long periods as a safety device for refrigeration equipment, and which has a strong mechanical strength such as creep strength. Means for Solving the Problem: A fusible plug employs an alloy for fusible plugs which comprises 5-8 mass % of Sn, 31-34 mass % of Bi, 0.2-4 mass % of Sb, and a remainder of In and which melts at approximately 66-70° C. A total of at most 2.0 mass % of at least one element selected from strengthening elements consisting of 0.1-1.0 mass % of Cu, 0.1-1.0 mass % of Ge, 0.1-0.7 mass % of Ag, 0.1-0.6 mass % of Au, 0.2-0.6 mass % of Zn, 0.02-0.1 mass % of Ni, and 0.01-0.1 mass % of a lanthanoid may be added.

Abstract: The present invention is directed to overcome such a problem associated with a sprinkler head made of In-based alloy with no use of Pb or Cd that in contradiction with the fact that a testing temperature in a strength test of a sprinkler head is proximal to a melting temperature of a solder alloy used in a heat-sensitive decomposition structure of the sprinkler head, and therefore a good creeping property over a higher temperature zone in which a sprinkler is activated is required, typically, the sprinkler head made of the In-based alloy with no use of Pb or Cd could not achieve the creeping property over the higher temperature zone in which the sprinkler is activated as favorably as any conventional sprinkler head using Pb or Cd could do, and could occasionally end in failure in a durability test. To solve the above problem, the present invention provides an alloy usable for a heat-sensitive material in a sprinkler head, which is composed of Sn in an amount of 0.1-2.

Abstract: Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.

Abstract: Problem A conventional alloy for a fusible plug contained harmful elements such as Cd or Pb, so there was a concern of pollution by these harmful elements. The present invention provides a fusible plug which does not contain the harmful components Cd or Pb, with which the alloy is not forced out of the fusible plug even when used for long periods as a safety device for refrigeration equipment, and which has a high mechanical strength such as creep strength. Means for Solving the Problem A fusible plug is used which employs a fusible alloy consisting essentially of 0.1-2.0 mass percent of Sn, 31-37 mass percent of Bi, and a remainder of In, the alloy melting at approximately at 70-75° C. A fusible plug is used which employs an alloy consisting essentially of 0.05-0.4 mass percent of Zn, 47-55 mass percent of Bi, and a remainder of In, the alloy melting at approximately 90-95° C.

Abstract: In reflow soldering using a solder paste formed by mixing a flux and a solder powder, the present invention suppresses the formation of voids and prevents the formation of large-diameter voids which have an adverse effect on the reliability of soldering. The flux contains a solder for which the temperature at which the decrease in mass measured by the TG method is 15 mass % is at least 5° C. higher than the peak heat absorption temperature of the solder.

Abstract: Provided is a waterproof cover that provides a waterproof effect even if a device itself is not of a waterproof structure, and does not hinder a maintenance work. A holder and a first cover portion are fixed to a bottom surface of a portable printer by a screw or the like. A second cover portion is connected to a first cover portion by a snap and a surface fastener in a state where the second cover portion covers the portable printer. An opening portion is disposed at a lower portion of the waterproof cover, and a recording medium discharged from the portable printer is guided by a guide portion within the second cover portion and discharged from the opening portion to the external. When conducting a maintenance work, only the surface fastener is detached while keeping the snap connected, and the second cover portion 4 is moved to a position where the second cover portion 4 does not cover the portable printer 2, with the second cover portion being connected to the first cover portion by the snap.

Abstract: Lead-free solder balls having a smooth surface and no shrinkage cavities or wrinkles are made of a lead-free solder which comprises, by atomic percent, 3%-6% of Ag, 1%-4% of Cu, 0.01%-2% of at least one element of the iron group and preferably Co, optionally 0.04%-4% of P, and a balance of Sn.

Abstract: A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.

Abstract: Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.

Abstract: A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.

Abstract: Lead-free solder balls having a smooth surface and no shrinkage cavities or wrinkles are made of a lead-free solder which comprises, by atomic percent, 3%-6% of Ag, 1%-4% of Cu, 0.01%-2% of at least one element of the iron group and preferably Co, optionally 0.04%-4% of P, and a balance of Sn.

Abstract: A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.

Abstract: A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.