Abstract: A substrate fixing device includes a ceramic base plate, a ceramic electrostatic chuck having a mounting surface on which a target object to be adsorbed is mounted, and an adhesion layer bonding the base plate and the electrostatic chuck.

Abstract: A substrate fixing device includes a base plate, a heating portion provided on the base plate, a metal layer provided on the heating portion, and an electrostatic chuck provided on the metal layer. In the substrate fixing device, the metal layer is made of the same material as the base plate.

Abstract: A substrate fixing device includes a base plate having a first surface in which a plurality of first bottomed holes are formed, an electrostatic chuck mounted on the first surface of the base plate and having a second surface facing the first surface, the second surface being formed therein with a plurality of second bottomed holes each connected to each of the first bottomed holes, and a plurality of fixing members each fit into one first bottomed hole and one second bottomed hole.

Abstract: A substrate fixing device includes a base plate, a ceramic plate fixed to the base plate and configured to adsorb a substrate by electrostatic force, and an adhesive layer bonding the base plate and the ceramic plate. The adhesive layer includes a plurality of linear heat transfer bodies arranged adjacent to each other such that a longitudinal direction of each linear heat transfer body is along a stack direction of the ceramic plate and the base plate, and a resin filled between adjacent heat transfer bodies of the heat transfer bodies and bonded to the ceramic plate and the base plate.

Abstract: A substrate fixing device includes a base plate, a ceramic plate bonded to the base plate via an adhesive layer and configured to adsorb a substrate by electrostatic force, a thermal conduction member arranged in only a central region, which overlaps a central portion of the ceramic plate in a plan view, or in only an outer circumferential region, which overlaps an outer circumferential portion of the ceramic plate in a plan view of at least one of an adhesive surface of the ceramic plate, an adhesive surface of the base plate, or an inside of the adhesive layer, the thermal conduction member having thermal conductivity in a stack direction of the base plate and the ceramic plate member higher than thermal conductivity in a plane direction perpendicular to the stack direction.

Abstract: A substrate fixing device includes a base plate, a ceramic plate, and a thermal conduction member. The ceramic plate is bonded to the base plate via an adhesive layer, and has an electrode embedded therein for generating heat, and configured to adsorb a substrate by electrostatic force. The thermal conduction member is arranged in at least one of an adhesive surface of the ceramic plate, an adhesive surface of the base plate, and an inside of the adhesive layer, and having thermal conductivity in a stack direction of the base plate and the ceramic plate higher than thermal conductivity in a plane direction perpendicular to the stack direction.

Abstract: A substrate fixing device includes: an electrostatic chuck that is configured to adsorb and retain an object thereon, and including a base body on which the object is mounted, and an electrostatic electrode that is provided in the base body; and a base plate on which the electrostatic chuck is mounted, and having a plurality of through holes each exposing a first face of the base body facing the base plate. Laser light is emitted from each of the through holes toward the base body.