Abstract: A rinse liquid remaining on a substrate after a rinsing process is replaced with a replacement liquid having a surface tension lower than that of the rinse liquid. During this replacement, a nozzle device is arranged at a nozzle upper position higher than a processing cup. The nozzle device is moved from a center to an outer peripheral end of the substrate in a horizontal direction while downwardly discharging the replacement liquid. Thereafter, the substrate is dried. During this drying, the nozzle device is lowered from a position above the center of the substrate to a nozzle lower position close to the substrate while gas is downwardly injected from the nozzle device. Further, the nozzle device is moved in a horizontal direction from the center to the outer peripheral end of the substrate while injection of gas is continued.

Abstract: A substrate processing apparatus includes a substrate holder, a nozzle, a liquid flow path, an adjustment valve that adjusts a flow rate of the processing liquid flowing through the liquid flow path, a nozzle movement device that moves the nozzle, and a controller that controls the nozzle movement device based on a nozzle movement condition and controls an adjustment valve based on a valve condition. The nozzle movement condition includes a plurality of portion movement information pieces defining movement speeds of the nozzle when the nozzle moves through the plurality of portions of the substrate. The valve condition includes a plurality of valve control information pieces representing methods of controlling the valve when the nozzle moves through the plurality of portions of the substrate. The plurality of valve control information pieces include first valve control information, and second valve control information different from the first valve control information.

Abstract: A rinse liquid remaining on a substrate after a rinsing process is replaced with a replacement liquid having a surface tension lower than that of the rinse liquid. During this replacement, a nozzle device is arranged at a nozzle upper position higher than a processing cup. The nozzle device is moved from a center to an outer peripheral end of the substrate in a horizontal direction while downwardly discharging the replacement liquid. Thereafter, the substrate is dried. During this drying, the nozzle device is lowered from a position above the center of the substrate to a nozzle lower position close to the substrate while gas is downwardly injected from the nozzle device. Further, the nozzle device is moved in a horizontal direction from the center to the outer peripheral end of the substrate while injection of gas is continued.

Abstract: A substrate processing apparatus includes a processing liquid tank, a first circulation pipe, a filter, a pump, and a controller. The first circulation pipe has an upstream end connected to the processing liquid tank and a downstream end connected to the processing liquid tank. A processing liquid circulates in the first circulation pipe. The filter is deposed in the first circulation pipe and captures particles contained in the processing liquid. The pump is disposed in the first circulation pipe. The pump includes a rotor and feeds the processing liquid by rotating the rotor. In activation of the pump in a stopped state, the controller controls the pump so that the rotor rotates at a rotational acceleration of no greater than 400 rpm/sec.

Abstract: A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions.

Abstract: A rinse liquid remaining on a substrate after a rinsing process is replaced with a replacement liquid having a surface tension lower than that of the rinse liquid. During this replacement, a nozzle device is arranged at a nozzle upper position higher than a processing cup. The nozzle device is moved from a center to an outer peripheral end of the substrate in a horizontal direction while downwardly discharging the replacement liquid. Thereafter, the substrate is dried. During this drying, the nozzle device is lowered from a position above the center of the substrate to a nozzle lower position close to the substrate while gas is downwardly injected from the nozzle device. Further, the nozzle device is moved in a horizontal direction from the center to the outer peripheral end of the substrate while injection of gas is continued.

Abstract: A substrate processing apparatus includes a chemical liquid nozzle 31 that includes a chemical liquid discharge port 95 discharging a chemical liquid in a chemical liquid discharge direction D1, inclined with respect to an upper surface of a substrate W, toward a target position P1 within the upper surface of the substrate W, a spray shield 101 that includes a shield surface 104 directly opposing the upper surface of the substrate W and with which the shield surface 104 overlaps with the target position P1 in plan view and, when the chemical liquid nozzle 31 and the shield surface 104 are viewed from below, all portions of the chemical liquid discharge port 95 are disposed at an outer side of an outer edge of the shield surface 104 or on the outer edge of the shield surface 104, and a nozzle moving unit 38 that moves the chemical liquid nozzle 31 together with the spray shield 101.

Abstract: A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions.

Abstract: A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions.

Abstract: A substrate processing apparatus includes a chemical liquid nozzle 31 that includes a chemical liquid discharge port 95 discharging a chemical liquid in a chemical liquid discharge direction D1, inclined with respect to an upper surface of a substrate W, toward a target position P1 within the upper surface of the substrate W, a spray shield 101 that includes a shield surface 104 directly opposing the upper surface of the substrate W and with which the shield surface 104 overlaps with the target position P1 in plan view and, when the chemical liquid nozzle 31 and the shield surface 104 are viewed from below, all portions of the chemical liquid discharge port 95 are disposed at an outer side of an outer edge of the shield surface 104 or on the outer edge of the shield surface 104, and a nozzle moving unit 38 that moves the chemical liquid nozzle 31 together with the spray shield 101.

Abstract: A substrate processing apparatus includes a processing liquid tank, a first circulation pipe, a filter, a pump, and a controller. The first circulation pipe has an upstream end connected to the processing liquid tank and a downstream end connected to the processing liquid tank. A processing liquid circulates in the first circulation pipe. The filter is deposed in the first circulation pipe and captures particles contained in the processing liquid. The pump is disposed in the first circulation pipe. The pump includes a rotor and feeds the processing liquid by rotating the rotor. In activation of the pump in a stopped state, the controller controls the pump so that the rotor rotates at a rotational acceleration of no greater than 400 rpm/sec.

Abstract: A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions.