Patents by Inventor Rinat Shimshi

Rinat Shimshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8924904
    Abstract: Embodiments of the present invention provide methods and apparatuses for determining factors for design consideration in yield analysis of semiconductor fabrication. In one embodiment, a computer-implemented method for determining factors for design consideration in yield analysis of semiconductor fabrication includes obtaining a geometric characteristic of a defect on a chip and obtaining design data of the chip, where the design data is associated with the defect. The method further includes determining a criticality factor of the defect based on the geometric characteristic and the design data, and outputting the criticality factor.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: December 30, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Vicky Svidenko, Youval Nehmadi, Rinat Shimshi, Alexander T. Schwarm, Sundar Jawaharlah
  • Patent number: 8799831
    Abstract: In one embodiment, an inline defect analysis method includes receiving geometric characteristics of individual defects and design data corresponding to the individual defects, determining which of the individual defects are likely to be nuisance defects using the geometric characteristics and the corresponding design data, and refraining from sampling the defects that are likely to be nuisance defects.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: August 5, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Youval Nehmadi, Rinat Shimshi, Vicky Svidenko, Alexander T. Schwarm, Sundar Jawaharlal
  • Patent number: 8688398
    Abstract: Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: April 1, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Vijay Sakhare, Sekar Krishnasamy, Mordechai Leska, Donald Foldenauer, Rinat Shimshi, Marvin L. Freeman, Jeffery Hudgens, Satish Sundar
  • Patent number: 8335582
    Abstract: In one embodiment, a method for providing a user interface to graphically indicate a cause for fault-related events includes providing a user interface to illustrate a plurality of fault-related events for a plurality of recipes performed on a plurality of manufacturing process hardware tools, presenting in the user interface the plurality of recipes in a first axis and the plurality of manufacturing process hardware tools in a second axis, and graphically indicating in the user interface whether the plurality of fault-related events were caused by one of the plurality of manufacturing process hardware tools or one of the plurality of recipes performed on the one manufacturing process hardware tools.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: December 18, 2012
    Assignee: Applied Materials, Inc.
    Inventor: Rinat Shimshi
  • Publication number: 20120271590
    Abstract: Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.
    Type: Application
    Filed: June 14, 2012
    Publication date: October 25, 2012
    Inventors: Vijay Sakhare, Sekar Krishnasamy, Mordechai Leska, Donald Foldenauer, Rinat Shimshi, Marvin L. Freeman, Jeffery Hudgens, Satish Sundar
  • Patent number: 8260461
    Abstract: Described herein is a method and system for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes manually calibrating a center of a robot blade aligned with respect to a target. The method further includes recording a first positional value of the center of the robot blade aligned with respect to a camera. The method further includes automatically determining a second positional value of the center of the robot blade aligned with respect to the camera. The method further includes automatically recalibrating the robot blade based on an offset between the second positional value and the first positional value exceeding a tolerance offset from the first positional value.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: September 4, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Sekar Krishnasamy, Vijay Sakhare, Mordechai Leska, Donald Foldenauer, Rinat Shimshi, Satish Sundar
  • Patent number: 8224607
    Abstract: Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: July 17, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Vijay Sakhare, Sekar Krishnasamy, Mordechai Leska, Donald Foldenauer, Rinat Shimshi, Marvin L. Freeman, Jeffery Hudgens, Satish Sundar
  • Patent number: 7962864
    Abstract: In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a new wafer design, yield is predicted separately for the systematic defects and the random defects. A combined yield is then calculated based on the yield predicted for the systematic defects and the yield predicted for the random defects.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: June 14, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Youval Nehmadi, Rinat Shimshi, Vicky Svidenko, Alexander T. Schwarm, Sundar Jawaharlal
  • Patent number: 7937179
    Abstract: In one embodiment, a method for predicting yield includes calculating a criticality factor (CF) for each of a plurality of defects detected in an inspection process step of a wafer, and determining a yield-loss contribution of the inspection process step to the final yield based on CFs of the plurality of defects and the yield model built for a relevant design. The yield-loss contribution of the inspection process step is then used to predict the final yield for the wafer.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: May 3, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Rinat Shimshi, Youval Nehmadi, Vicky Svidenko, Alexander T. Schwarm, Sundar Jawaharlal
  • Patent number: 7760929
    Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: July 20, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Jacob J. Orbon, Youval Nehmadi, Ofer Bokobza, Ariel Ben-Porath, Erez Ravid, Rinat Shimshi, Vicky Svidenko
  • Publication number: 20100073011
    Abstract: A method and apparatus for exposing a solar device to simulated environmental conditions is described. In one embodiment, a chamber is described. The chamber includes a frame defining a partial enclosure having an interior volume, the frame comprising a door selectively sealing an opening in the frame, a plurality of lighting devices coupled to the enclosure interior of an open wall, each of the plurality of lighting devices being positioned to direct light toward an upper surface of a platen disposed in the interior area, and a plurality of fan units positioned in an opening formed in a sidewall of the frame, each of the plurality of fan units positioned to direct ambient air flow from the outside of the enclosure toward the platen and between the plurality of lighting devices to exit through the open wall.
    Type: Application
    Filed: September 22, 2009
    Publication date: March 25, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Vicky Svidenko, Rinat Shimshi, Yuqiang Li
  • Publication number: 20090287339
    Abstract: In one embodiment, a method for providing a user interface to graphically indicate a cause for fault-related events includes providing a user interface to illustrate a plurality of fault-related events for a plurality of recipes performed on a plurality of manufacturing process hardware tools, presenting in the user interface the plurality of recipes in a first axis and the plurality of manufacturing process hardware tools in a second axis, and graphically indicating in the user interface whether the plurality of fault-related events were caused by one of the plurality of manufacturing process hardware tools or one of the plurality of recipes performed on the one manufacturing process hardware tools.
    Type: Application
    Filed: February 10, 2009
    Publication date: November 19, 2009
    Applicant: Applied Materials, Inc.
    Inventor: Rinat Shimshi
  • Publication number: 20090062960
    Abstract: Described herein is a method and system for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes manually calibrating a center of a robot blade aligned with respect to a target. The method further includes recording a first positional value of the center of the robot blade aligned with respect to a camera. The method further includes automatically determining a second positional value of the center of the robot blade aligned with respect to the camera. The method further includes automatically recalibrating the robot blade based on an offset between the second positional value and the first positional value exceeding a tolerance offset from the first positional value.
    Type: Application
    Filed: August 25, 2008
    Publication date: March 5, 2009
    Inventors: Sekar Krishnasamy, Vijay Sakhare, Mordechai Leska, Donald Foldenauer, Rinat Shimshi
  • Publication number: 20090062959
    Abstract: Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.
    Type: Application
    Filed: August 25, 2008
    Publication date: March 5, 2009
    Inventors: Vijay Sakhare, Sekar Krishnasamy, Mordechai Leska, Donald Foldenauer, Rinat Shimshi, Marvin L. Freeman, Jeffery Hudgens
  • Publication number: 20080295063
    Abstract: Embodiments of the present invention provide methods and apparatuses for determining factors for design consideration in yield analysis of semiconductor fabrication. In one embodiment, a computer-implemented method for determining factors for design consideration in yield analysis of semiconductor fabrication includes obtaining a geometric characteristic of a defect on a chip and obtaining design data of the chip, where the design data is associated with the defect. The method further includes determining a criticality factor of the defect based on the geometric characteristic and the design data, and outputting the criticality factor.
    Type: Application
    Filed: May 22, 2008
    Publication date: November 27, 2008
    Inventors: Vicky Svidenko, Youval Nehmadi, Rinat Shimshi, Alexander T. Schwarm, Sundar Jawaharlal
  • Publication number: 20080294281
    Abstract: In one embodiment, a method for predicting yield includes calculating a criticality factor (CF) for each of a plurality of defects detected in an inspection process step of a wafer, and determining a yield-loss contribution of the inspection process step to the final yield based on CFs of the plurality of defects and the yield model built for a relevant design. The yield-loss contribution of the inspection process step is then used to predict the final yield for the wafer.
    Type: Application
    Filed: May 22, 2008
    Publication date: November 27, 2008
    Inventors: Rinat Shimshi, Youval Nehmadi, Vicky Svidenko, Alexander T. Schwarm, Sundar Jawaharlal
  • Publication number: 20080295048
    Abstract: In one embodiment, an inline defect analysis method includes receiving geometric characteristics of individual defects and design data corresponding to the individual defects, determining which of the individual defects are likely to be nuisance defects using the geometric characteristics and the corresponding design data, and refraining from sampling the defects that are likely to be nuisance defects.
    Type: Application
    Filed: May 22, 2008
    Publication date: November 27, 2008
    Inventors: Youval Nehmadi, Rinat Shimshi, Vicky Svidenko, Alexander T. Schwarm, Sundar Jawaharlal
  • Publication number: 20080295047
    Abstract: In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a new wafer design, yield is predicted separately for the systematic defects and the random defects. A combined yield is then calculated based on the yield predicted for the systematic defects and the yield predicted for the random defects.
    Type: Application
    Filed: May 22, 2008
    Publication date: November 27, 2008
    Inventors: Youval Nehmadi, Rinat Shimshi, Vicky Svidenko, Alexander T. Schwarm, Sundar Jawaharlal
  • Publication number: 20070052963
    Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.
    Type: Application
    Filed: October 27, 2006
    Publication date: March 8, 2007
    Inventors: JACOB ORBON, Youval Nehmadi, Ofer Bokobza, Ariel Ben-Porath, Erez Ravid, Rinat Shimshi, Vicky Svidenko