Abstract: This disclosure relates to a leadless packaged semiconductor device including a top and a bottom opposing major surfaces and sidewalls extending between the top and bottom surfaces, the leadless packaged semiconductor device further includes a lead frame structure including an array of two or more lead frame sub-structures each having a semiconductor die arranged thereon, and terminals and a track extended across the bottom surface of the semiconductor device. The track provides a region for interconnecting the semiconductor die and terminals, and the track is filled by an insulating material to isolate the lead frame sub-structures.

Abstract: Techniques for fabrication of implant material for the reconstruction of fractured eye orbit may include using an image processing system to analyze a set of two-dimensional images representing a three-dimensional scan of a skull of a patient, automatically detect an orbital fracture in the skull based on the set of two-dimensional images, and identify which/both of the two eye orbits containing any orbital fracture. The techniques may further include, for each of the two-dimensional images in which the orbital fracture is detected, determining a region of interest, and extracting the region of interest. The techniques may further include generating a three-dimensional reconstruction model for the fractured eye orbit, and outputting model data for generating an implant mold for the fractured eye orbit.

Abstract: This disclosure relates to a leadless packaged semiconductor device including a top and a bottom opposing major surfaces and sidewalls extending between the top and bottom surfaces, the leadless packaged semiconductor device further includes a lead frame structure including an array of two or more lead frame sub-structures each having a semiconductor die arranged thereon, and terminals and a track extended across the bottom surface of the semiconductor device. The track provides a region for interconnecting the semiconductor die and terminals, and the track is filled by an insulating material to isolate the lead frame sub-structures.

Abstract: Techniques for fabrication of implant material for the reconstruction of fractured eye orbit may include using an image processing system to analyze a set of two-dimensional images representing a three-dimensional scan of a skull of a patient, automatically detect an orbital fracture in the skull based on the set of two-dimensional images, and identify which/both of the two eye orbits containing any orbital fracture. The techniques may further include, for each of the two-dimensional images in which the orbital fracture is detected, determining a region of interest, and extracting the region of interest. The techniques may further include generating a three-dimensional reconstruction model for the fractured eye orbit, and outputting model data for generating an implant mold for the fractured eye orbit.