Abstract: A wiring board according to the present disclosure, includes: a build-up layer including; a first insulation layer having a first surface and a second surface located opposite to the first surface; and a first electrical conductor layer located on the first surface; and a solder resist covering a portion of, the first surface and the first electrical conductor layer. The build-up layer includes a mounting region on the first surface in which an electronic component including an inductor is mounted. The mounting region includes a first region at a location opposite to the inductor when the electronic component is mounted. The first electrical conductor layer and the solder resist are not located in the first region.

Abstract: A wiring board of the present disclosure includes: an insulating base having a first surface including a mounting region and a second surface connected to an external board; a power supply conductor including a first planar conductor, and first linear conductors; a grounding conductor including a second planar conductor, and second linear conductors; power supply terminals, being electrically connected to the first planar conductor; and grounding terminals being electrically connected to the second planar conductor.