Abstract: An object of the present invention is to provide a corrosive environment monitoring apparatus and a corrosive environment monitoring method for evaluating the corrosiveness of an ambient environment simply and accurately in a short time period. The corrosive environment monitoring apparatus (1) of this invention has at least one vent duct (3a, 3b, 3c) in which specimens (2a, 2b, 2c) are installed so that the corrosiveness of the ambient environment is measured from the corroded conditions of the specimens (2a, 2b, 2c). The regions of the specimens (2a, 2b, 2c) in one vent duct (3a, 3b, 3c), which are subject to measurement, are made of the same metallic material. If a plurality of vent ducts (3a, 3b, 3c) are provided, these vent ducts (3a, 3b, 3c) are arranged in parallel with one another.

Abstract: An object of the present invention is to provide a corrosive environment monitoring apparatus and a corrosive environment monitoring method for evaluating the corrosiveness of an ambient environment simply and accurately in a short time period. The corrosive environment monitoring apparatus (1) of this invention has at least one vent duct (3a, 3b, 3c) in which specimens (2a, 2b, 2c) are installed so that the corrosiveness of the ambient environment is measured from the corroded conditions of the specimens (2a, 2b, 2c). The regions of the specimens (2a, 2b, 2c) in one vent duct (3a, 3b, 3c), which are subject to measurement, are made of the same metallic material. If a plurality of vent ducts (3a, 3b, 3c) are provided, these vent ducts (3a, 3b, 3c) are arranged in parallel with one another.

Abstract: An object of the present invention is to provide a thermal airflow sensor that prevents moisture absorption by a silicon oxide film formed closest to a surface (formed to be located on an uppermost portion), and that reduces a measuring error. In order to attain the foregoing object, the thermal airflow sensor according to the present invention applies an ion implantation to a silicon oxide film 4, formed closest to a surface (formed to be located on an uppermost portion), by using an atom or molecule selected from at least any one of silicon, oxygen, and an inert element such as argon or nitrogen, in order to increase a concentration of an atom contained in the silicon oxide film 4 more than that before the ion implantation.

Abstract: An object of the present invention is to provide a thermal airflow sensor that prevents moisture absorption by a silicon oxide film formed closest to a surface (formed to be located on an uppermost portion), and that reduces a measuring error. In order to attain the foregoing object, the thermal airflow sensor according to the present invention applies an ion implantation to a silicon oxide film 4, formed closest to a surface (formed to be located on an uppermost portion), by using an atom or molecule selected from at least any one of silicon, oxygen, and an inert element such as argon or nitrogen, in order to increase a concentration of an atom contained in the silicon oxide film 4 more than that before the ion implantation.

Abstract: A measurement element includes a semiconductor substrate with electrical insulating film formed thereon. A resistor formed on the electrical insulating film constitutes a heater; and a cavity is formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in the thickness direction. The measurement element has a film formed covering the region of the opening or slit.

Abstract: In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.

Abstract: A temperature of the heating resistor is set at a temperature equal to or higher than a temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Alternatively, when a heating resistance type air flow rate measuring device starts to operate or stops operating, the temperature of the heating resistor may be set at a temperature equal to or higher than the temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Moreover, a water-repellent and oil-repellent protective coating may be provided on the surface of the heating resistor.

Abstract: An object of the present invention is to provide a structure unlikely to break in the dicing process while allowing easy execution of screening, for a measurement element in which a resistor constituting a heater is formed on a thin wall part thermally insulated from a semiconductor substrate by providing a cavity part formed in the semiconductor substrate. Provided is a measurement element including: a semiconductor substrate; an electrical insulating film formed on the semiconductor substrate; a resistor formed on the electrical insulating film, the resistor constituting a heater; and a cavity formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and any of an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in a thickness direction thereof.

Abstract: In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.

Abstract: In a liquid cooling system, comprising: a heat-receiving jacket for receiving heat from a heat-generation body therein; a heat-radiator for radiating the heat therefrom, which is received within the heat-receiving jacket; and a tank for accumulating refrigerant therein, which is connected with the heat-receiving jacket and the heat-radiator through flow passages, thereby enclosing a refrigerant within the heat-receiving jacket, the heat-radiator and the tank, including the flow passages provided therebetween, and further comprising: a liquid transfer means for generating a circulation flow of the refrigerant enclosed therein, wherein the tank is built up on one side surface of a substrate having superior heat-conductivity and heat-resistance, defined between a flexible film or sheet having superior heat-conductivity and heat-resistance, and the heat-radiator having a heat-radiation flow passage on the other side surface thereof, defined between the flexible film or sheet having superior heat-conductivity and

Abstract: In an electronic apparatus having a heat-generating element therein, a cooling jacket 100 for transmitting heat generated from the heat-generating element 200 into to a liquid coolant flowing therein, comprises: a cover 130 building up a heat transfer surface to be in contact with a surface of the heat-generating element; a passage 110 for the liquid coolant, which is formed neighboring with the heat transfer surface and wound round in a “S”-like manner within an inside of a main body 120 of the cooling jacket; and an inlet 111 and an outlet 112 attached at both ends of the flow passage of the liquid coolant, and further a dispersion member 150 is disposed in the flow passage, being built up by gathering a plural number of members, each of which has a “U”-like cross-section of an aspect ratio from 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element thereto with high efficiency, and thereby enabling to cool down the heat-generating element, fully,

Abstract: A liquid crystal projector, a liquid crystal panel, and a liquid cooling apparatus, for obtaining a picture without disturbance due to a liquid coolant passing through a transparent surface of the liquid crystal panel, with achieving cooling effectively with an aid of a liquid cooling cycle, wherein lights from a light source 112 is divided into three (3) parallel light beams,

Abstract: A liquid cooling system is disclosed for use in an electronic apparatus. The system is constructed to be of a reduced size and thickness, thus allowing it to be used for cooling heat-generating devices such as semiconductor elements, while maintaining corrosion resistance. The system includes a pump, a heat-receiving jacket, and flow passages through which the cooling liquid is circulated. An ion exchange bag having a water-permeable bag is disposed within the liquid cooling system. The water-permeable bag further contains an ion exchange resin therein.

Abstract: A liquid cooling system, enabling protection from corrosion due to liquid coolant for a long time-period (5–10 years) while cooling a heat-generation body effectively, comprises a pump 108, a heat-receiving jacket 107, a radiator for radiating heat into an outside, being made up with a heat-radiation pipe 201 and a heat-radiation plate 202, and further a tank 203 for accumulating the liquid coolant 209 within an inside thereof, wherein those are connected in a closed-loop, so as to circulating the cooling liquid therein, thereby cooling the heat-generation of a CPU 106, being a heat-generation element, effectively, through the heat-receiving jacket 107, and further a water-permeable bag 204 is disposed in a portion of flow path of the cooling liquid, which receives microcapsules 10 therein, each enclosing in an inside thereof anti-corrosion agent 20 for suppressing the corrosion due to the cooling liquid, including such as, a water, etc.

Abstract: In an electronic apparatus having a heat-generating element therein, a cooling jacket 100 for transmitting heat generated from the heat-generating element 200 into to a liquid coolant flowing therein, comprises: a cover 130 building up a heat transfer surface to be in contact with a surface of the heat-generating element; a passage 110 for the liquid coolant, which is formed neighboring with the heat transfer surface and wound round in a “S”-like manner within an inside of a main body 120 of the cooling jacket; and an inlet 111 and an outlet 112 attached at both ends of the flow passage of the liquid coolant, and further a dispersion member 150 is disposed in the flow passage, being built up by gathering a plural number of members, each of which has a “U”-like cross-section of an aspect ratio from 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element thereto with high efficiency, and thereby enabling to cool down the heat-generating element, fully,

Abstract: A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

Abstract: An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

Abstract: A liquid cooling system, enabling protection from corrosion due to liquid coolant for a long time-period (5-10 years) while cooling a heat-generation body effectively, comprises a pump 108, a heat-receiving jacket 107, a radiator for radiating heat into an outside, being made up with a heat-radiation pipe 201 and a heat-radiation plate 202, and further a tank 203 for accumulating the liquid coolant 209 within an inside thereof, wherein those are connected in a closed-loop, so as to circulating the cooling liquid therein, thereby cooling the heat-generation of a CPU 106, being a heat-generation element, effectively, through the heat-receiving jacket 107, and further a water-permeable bag 204 is disposed in a portion of flow path of the cooling liquid, which receives microcapsules 10 therein, each enclosing in an inside thereof anti-corrosion agent 20 for suppressing the corrosion due to the cooling liquid, including such as, a water, etc.

Abstract: A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

Abstract: A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.