Abstract: A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.

Abstract: An apparatus and method provide a protective coating (60) that extends within a feed slot (40) and is limited so as to not extend into a firing chamber (47).

Abstract: Methods and systems for forming slots in a substrate that has opposing first and second surfaces. The method makes a laser cut through either the first or second surface of the substrate sufficient to form a first trench. Material is also removed through the other of the first and second surfaces effective to form, in combination with the laser cut, a slot. At least a portion of the slot passes entirely through the substrate, and the slot has an aspect ratio greater than or equal to 1.

Abstract: The described embodiments relate to substrates having features formed therein and methods of forming same. One exemplary method forms a blind feature through a majority of a thickness of a substrate, the blind feature being defined by at least one sidewall surface and a bottom surface. The method also applies an etch resistant material to the blind feature and removes the etch resistant material from at least a portion of the bottom surface. The method further wet etches the substrate at least through the bottom surface sufficient to form a through feature through the thickness of the substrate.

Abstract: A plate has a rectangular plate body with a plurality of nozzle arrays. The plate also has first and second end zones in between the plurality of nozzle arrays and opposing ends of the plate body, respectively. There is a break tab in at least one of the first and second end zones. In between the first and second end zones is a middle zone. A plating material encapsulates the plate body in the middle zone.

Abstract: The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate.

Abstract: Methods and systems for forming slots in a substrate that has opposing first and second surfaces. The method makes a laser cut through either the first or second surface of the substrate sufficient to form a first trench. Material is also removed through the other of the first and second surfaces effective to form, in combination with the laser cut, a slot. At least a portion of the slot passes entirely through the substrate, and the slot has an aspect ratio greater than or equal to 1.

Abstract: A plate has a rectangular plate body with a plurality of nozzle arrays. The plate also has first and second end zones in between the plurality of nozzle arrays and opposing ends of the plate body, respectively. There is a break tab in at least one of the first and second end zones. In between the first and second end zones is a middle zone. A plating material encapsulates the plate body in the middle zone.