Abstract: A lift pin system and a lift pin assembly are disclosed. In one or more approaches, a lift pin system includes a wafer support, such as an electrostatic chuck or a platen, and a lift pin assembly coupled to the wafer support. The lift pin assembly may include a plurality of pins. Each of the plurality of pins may include a tip extending through a housing, a spring within the housing, wherein the spring biases against the tip, and a support arm coupled to the housing. In some approaches, the housing is threadably coupled with the support arm to allow access to the tip of each pin above a top surface of the wafer support for easy replacement. The replaceable pin tips further permit easier customization of pin tip geometries, materials, spring force, etc., depending on specific process and/or wafer characteristics.

Abstract: A lift pin system and a lift pin assembly are disclosed. In one or more approaches, a lift pin system includes a wafer support, such as an electrostatic chuck or a platen, and a lift pin assembly coupled to the wafer support. The lift pin assembly may include a plurality of pins. Each of the plurality of pins may include a tip extending through a housing, a spring within the housing, wherein the spring biases against the tip, and a support arm coupled to the housing. In some approaches, the housing is threadably coupled with the support arm to allow access to the tip of each pin above a top surface of the wafer support for easy replacement. The replaceable pin tips further permit easier customization of pin tip geometries, materials, spring force, etc., depending on specific process and/or wafer characteristics.